Magnetron sputtering vacuum coating equipment for uniformly distributing process gas

A technology of vacuum coating and magnetron sputtering, applied in sputtering coating, vacuum evaporation coating, metal material coating process, etc., can solve problems such as uneven gas distribution, and achieve the effect of avoiding disturbance and uniform gas distribution

Pending Publication Date: 2019-03-01
ZHEJIANG SHANGFANG ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a magnetron sputtering vacuum coating equipment, which solves the u

Method used

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  • Magnetron sputtering vacuum coating equipment for uniformly distributing process gas
  • Magnetron sputtering vacuum coating equipment for uniformly distributing process gas
  • Magnetron sputtering vacuum coating equipment for uniformly distributing process gas

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Embodiment Construction

[0023] Such as Figure 1-3 As shown, a magnetron sputtering vacuum coating equipment includes a vacuum chamber 1, the intake side of the vacuum chamber 1 has an opening and a door panel 2 that closes the opening, the inside of the door panel 2 is provided with a concave mixing baffle 3, the mixing baffle The edge of the board 3 has a folded edge, and the folded edge is fixed on the door panel 2, and the mixing baffle 3 extends into the interior of the vacuum chamber 1 as a whole, and an air outlet 31 is arranged on the folded edge in the length direction. The outside of the mixing baffle 3 is also provided with an anti-collision baffle 4 for protecting the mixing baffle and preventing materials from being deposited on the mixing baffle 3 .

[0024] The main purpose of adopting the above-mentioned structure is to facilitate assembly. If this factor is not considered, other side openings of the vacuum chamber can also be opened, but after the vacuum chamber is finalized, it is d...

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Abstract

The invention discloses magnetron sputtering vacuum coating equipment for uniformly distributing process gas. The magnetron sputtering vacuum coating equipment for uniformly distributing process gas comprises a vacuum chamber, wherein the process gas is fed into the vacuum chamber and a target material is placed in the vacuum chamber during coating; a mixing baffle is arranged between a gas inletside of the vacuum chamber and the target material; a gap as a gas mixing buffer chamber is formed between the mixed baffle and the inner wall of the gas inlet side of the vacuum chamber; a gas outletis formed in a side of the gap; a plurality of gas distributing tubes are arranged in the gas mixing buffer chamber; and gas distribution holes are formed in each gas distributing tube. The mixing baffle is arranged in the vacuum chamber, the process gas blown out from the gas distributing tubes collides with the front surface of the mixing baffle at first, thus, the gas is fully mixed in the gasmixing buffer chamber, after the gas is uniform, the gas is then blown out slowly from the gas outlet of the side surface, disturbance to the gas in the vacuum chamber is avoided, and thus, the gas in the vacuum chamber is distributed uniformly.

Description

technical field [0001] The invention relates to vacuum coating equipment, in particular to a magnetron sputtering vacuum coating equipment with uniform process gas distribution. Background technique [0002] The working principle of magnetron sputtering is that electrons collide with argon atoms in the process of flying to the substrate under the action of electric field E, so that they are ionized to produce Ar positive ions and new electrons; new electrons fly to the substrate, Ar ions are accelerated to the cathode target under the action of an electric field, and bombard the target surface with high energy to cause sputtering of the target. In sputtering particles, neutral target atoms or molecules are deposited on a substrate to form a thin film. It is very important for the process distribution to be evenly distributed in the vacuum chamber. If the process gas is not evenly distributed in the vacuum chamber, there are disturbances, etc., which will lead to uneven coat...

Claims

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Application Information

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IPC IPC(8): C23C14/35
CPCC23C14/35C23C14/0063
Inventor 刘杰来华杭施成亮
Owner ZHEJIANG SHANGFANG ELECTRONICS EQUIP
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