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A processing method for reducing short circuit and residual copper in inner layer of pcb board
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A technology of PCB board and processing method, which is applied in the field of PCB processing, can solve problems such as scrapping and product short circuit, and achieve the effect of improving production yield, improving residual copper, and reducing the risk of customer complaints
Active Publication Date: 2020-08-11
广东喜珍电路科技有限公司
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Problems solved by technology
[0002] In today's world, with the rapid development of science and technology, people's requirements for circuit boards are getting higher and higher. With the increasingly precise production requirements of circuit boards, both inner and outer circuit designs are becoming denser. Too much residual copper is likely to cause a short circuit of the product, resulting in scrapping
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Embodiment 1
[0032] A processing method for reducing PCB inner layer short circuit and residual copper, characterized in that it comprises the following steps:
[0033] S1. Pretreatment, including the brushing section, to brush the surface of the PCB board;
[0034] S2. Coating, including setting the hardness of the coating wheel to 37-45°, setting the number of coating wheels to 8-16, leaving edges during the coating process, and coating starts from 3-7mm from the edge of the plate Cloth, edges uncoated;
[0035] S3. Exposure;
[0036] S4. Developing, including washing with a large washing tank after developing, and symmetrically setting overflow ports in the middle area and edge area of the washing tank;
[0037] S5. Etching;
[0038] S6. Withdraw the film;
[0039] S7. Board receiving and AOI inspection.
[0040] Further, in the step S4, washing is performed with pure water after developing.
[0041] In the present invention, the addition of brushing in the pre-treatment is base...
Embodiment 2
[0058] This embodiment provides a processing method consistent with Embodiment 1 to reduce the short circuit and residual copper in the inner layer of the PCB board. The difference is that in step S2, the coating process includes setting the hardness of the coating wheel to 37-45° , the number of coating wheels is set to 8-16, the edge is left during the coating process, the coating starts from 3-7mm from the edge of the plate, and the edge is not coated.
Embodiment 3
[0060] This embodiment provides a processing method consistent with Embodiment 1 to reduce the short circuit and residual copper in the inner layer of the PCB board. The difference is that in step S2, the coating process includes setting the hardness of the coating wheel to 37-45° , the number of coating wheels is set to 8-16, the edge is left during the coating process, the coating starts from 3-7mm from the edge of the plate, and the edge is not coated.
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Abstract
The invention provides a processing method for decreasing short circuit and residual copper of inner layers of PCBs. The processing method is characterized by comprising the following steps of: S1, preprocessing: polishing and brushing the surface of a PCB through a polishing and brushing section; S2, coating: setting the hardness of 8-16 coating wheels to be 37-45 DEG, remaining the edge in the coating process, carrying out coating from a place 3-7 mm from the PCB edge and not coating the edge; S3, exposure; S4, development: after the development, carrying out rinsing by adoption of a large rinsing bath, and symmetrically setting overflow ports at the middle area and edge area of the rinsing bath; S5, etching; S6, film removal; and S7, PCB storage and AOI detection.
Description
technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a processing method for reducing short circuit and residual copper in the inner layer of a PCB. Background technique [0002] In today's world, with the rapid development of science and technology, people's requirements for circuit boards are getting higher and higher. With the increasingly precise production requirements of circuit boards, both inner and outer circuit designs are becoming denser. More residual copper is likely to cause a short circuit of the product, resulting in scrapping. Contents of the invention [0003] In view of this, the present invention provides a processing method for reducing the short circuit and residual copper in the inner layer of the PCB. Through the method of the present invention, the phenomenon of short circuit and residual copper in the inner layer of the PCB is significantly improved, and the quality yield is greatly im...
Claims
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