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Heat sink and manufacturing method thereof

A manufacturing method and heat dissipation plate technology, applied in cooling/ventilation/heating transformation, electrical equipment construction parts, semiconductor/solid-state device parts, etc., can solve the problem of increasing the manufacturing cost of electronic products, unfavorable light and thin design of electronic products, heat pipes complex structure, etc.

Active Publication Date: 2020-11-24
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the complex internal structure of heat pipes usually increases the manufacturing cost of electronic products
On the other hand, electronic products equipped with heat pipes need to reserve a certain space to accommodate the heat pipes, which is not conducive to the thin and light design of electronic products

Method used

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  • Heat sink and manufacturing method thereof
  • Heat sink and manufacturing method thereof
  • Heat sink and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] like figure 1 As shown, in the embodiment of the present invention, the heat dissipation plate 100 is used for dissipating heat in an electronic product.

[0039] The heat dissipation plate 100 includes a first plate body 10 , a second plate body 20 disposed opposite to the first plate body 10 , a fixing adhesive layer 30 connecting the first plate body 10 and the second plate body 20 , a support column 40 , and the cooling liquid 50 accommodated between the first plate body 10 and the first plate body 10 .

[0040] The heat dissipation plate 100 has a first end A and a second end B. The first section A is an evaporation section, and the second end B is a condensation section.

[0041] Understandably, the first section A is the condensation end, and the second end B is the evaporation end. The first end A and the second end B are located at two ends of the first plate body 10 respectively.

[0042] In the heat dissipation plate 100 according to the first embodiment ...

no. 2 example

[0053] like figure 2 As shown, the heat dissipation plate 100a of the second embodiment of the present invention is similar to the heat dissipation plate 100 of the first embodiment, and the difference is that the first plate body 10a is an electronic product support structure.

no. 3 example

[0055] like image 3As shown, the heat dissipation plate 100b of the third embodiment of the present invention is similar to the heat dissipation plate 100 of the first embodiment, and the difference lies in that: the first plate body 10b is a supporting structure for electronic products, and the support columns 40b are Electronic product support structure. The support column 40b and the first plate body 10b are separately formed or integrally formed. The support column 40b extends vertically from the first plate body 10b toward the first plate body 10b and is connected to the second plate body 20 .

[0056] like Figure 4 As shown, when the heat dissipation plate of the present invention works, the first end A of the heat dissipation plate is in contact with a heat source 200 . The cooling liquid 50 is evaporated at the first end A, and the evaporated gas of the cooling liquid 50 flows back to the second end B along the inner wall of the first plate body 10 in the cavity 1...

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PUM

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Abstract

A heat dissipation plate cooperates with an electronic product to dissipate heat. The heat dissipation plate includes a first plate body, a second plate body, a fixed adhesive layer connected to both ends of the first plate body and the second plate body, and at least one support The column and the cooling liquid, the first plate body, the second plate body and the fixed glue layer are jointly surrounded to form a sealed cavity, and the cooling liquid is accommodated in the cavity and the at least one support The column is located in the cavity, the support column is perpendicular to the first plate body and the second plate body, the cavity communicates between the at least one support column, and the evaporation heat of the cooling liquid is 112kJ / kg to 119kJ / kg, the specific heat of the cooling liquid is 1183J / kg.K to 1220J / kg.K, the second board is made of copper and is used to connect with the heat source of the electronic product, so The surfaces of the first plate body and the second plate body facing the cavity are surfaces without capillary structure.

Description

technical field [0001] The invention relates to a heat dissipation plate, in particular to a heat dissipation plate and a manufacturing method thereof. Background technique [0002] Today's electronic products, such as mobile phones, tablets, smart bracelets, etc., are developing rapidly. Electronic products have more functions and stronger performance, so as to better meet the needs of consumers and improve the effect of consumer experience. [0003] The stronger performance of these electronic products needs to be realized by increasing the data processing speed, so that the electronic products need to be configured with high-frequency, multi-core CPUs and highly integrated circuits. However, the higher the frequency of the CPU, the higher the number of cores, and the higher the integration of the circuit board, the more heat is generated, and the electronic products need to be equipped with better heat dissipation methods to ensure normal operation. [0004] At present, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20336H01L23/427G06F1/203G06F2200/201H01L23/473
Inventor 胡先钦沈芾云何明展徐筱婷
Owner AVARY HLDG (SHENZHEN) CO LTD