Disposable full-surface vapor deposition support, vapor deposition furnace and deposition method thereof

Abstract

The invention discloses a disposable full-surface vapor deposition support, a vapor deposition furnace and a deposition method thereof. The disposable full-surface vapor deposition support comprises a coaxial first support and a second support, and at least one first support is formed on the first support a support plane, and a second support plane matching and coaxial with each first support plane is formed on the second bracket; in the first state, each of the first support planes is higher than the corresponding first support plane Two supporting planes; in the second state, each of the first supporting planes is lower than the corresponding second supporting plane. The present invention is ingenious in design, adopts two sets of bracket structures, and makes each support plane in one bracket higher or lower than the corresponding support plane in the other bracket, and can automatically switch the brackets in contact with the workpiece, thereby changing the shielding of the workpiece. It can realize one-time deposition, high degree of automation, simple operation, no need to stop the deposition process, time cost is reduced, and deposition efficiency is greatly improved.

Description

technical field [0001] The invention relates to the field of vapor deposition, in particular to a disposable full-surface vapor deposition support, a vapor deposition furnace and a deposition method thereof. Background technique [0002] Chemical Vapor Deposition (CVD) refers to the process of introducing the gaseous or liquid reactant vapor containing the film elements and other gases required for the reaction into the reaction chamber, and a chemical reaction occurs on the surface of the substrate to form a film. [0003] The CVD chemical vapor deposition furnace uses the principle of chemical vapor deposition (Chemical Vapor Deposition) to heat the substances involved in the chemical reaction to a certain process temperature, and under the gravitational force generated by the vacuum pump pumping system, it is led to the deposition chamber for reaction and deposition. , to generate a new solid thin film substance. [0004] as attached figure 1 The chemical vapor depositi...

AI Technical Summary

Problems solved by technology

[0006] However, these structures are not suitable for workpieces that require full-surface deposition, mainly because: during the deposition process, there are more or less certain contact areas between the substrate holder or the hanger and the parts, and these covered areas cannot always be covered. Deposition and film formation, if these areas are to be deposited into a film, the deposition process must be stopped, and the position of the workpiece on the spreader or fixture must be manually adjusted to expose the covered part of the workpiece before deposition, which cannot achieve a one-time full surface Deposition, greatly increasing the time cost of heating and cooling, cumbersome operation and low efficiency

[0007] The support structure of the existing deposition equipment has a large contact area with the workpiece, resulting in more covered areas, which also increases the impact on the uniformity of deposition

[0008] Moreover, most of the deposition equipment cannot satisfy multiple workpieces, especially disk parts, for one-time full-surface vapor deposition, and a deposition process often takes more than 20 hours, and the inability to deposit multiple workpieces at the same time is not conducive to deposition efficiency. improve

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