Glass substrate warpage measuring base platform and device

A glass substrate and measuring device technology, applied to measuring devices, using optical devices, instruments, etc., can solve the problems of the accuracy of laser scanning, the easy occurrence of edge chipping, and the difficulty of mechanical grooving, etc. The method is simple and reliable, the equipment is easy to maintain, and the processing difficulty is small.

Inactive Publication Date: 2019-03-08
RAINBOW (HEFEI) LIQUID CRYSTAL GLASS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the material of the marble itself, mechanical slotting is difficult, and the slot edges are prone to edge chipping, corner drop, etc., which will seriously affect the supporting effect of the glass substrate and affect the accuracy of laser scanning data collection.
[0005] In addition, since the glass substrate and the support mechanism are in surface contact, defects in the facet during processing, wear and deformation during use, glass powder or dust, etc., can cause local mechanical deformation of the glass substrate and affect the measurement of the warpage of the glass substrate As a result, objective and accurate data cannot be provided for the molding process. In addition, when warping is measured, the measuring laser head can only realize continuous scanning and data collection along the direction of the slot, but cannot be used in the direction of 90° to the slot. Continuous scanning, that is, for glass substrates, it can only ensure continuous scanning and data collection in one direction of flow or non-flow, which cannot meet the user's increasingly higher requirements for glass substrate quality

Method used

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  • Glass substrate warpage measuring base platform and device
  • Glass substrate warpage measuring base platform and device

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Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0027] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention provides a glass substrate warpage measuring base platform and a glass substrate warpage measuring device and belongs to the technical field of glass substrate manufacturing. The glass substrate warpage measuring base platform is used for carrying a glass substrate to be measured; the glass substrate warpage measuring base platform comprises a base, a test stand, a limiting plate andballs; the test stand is mounted on the base; the base is used for supporting the test stand; the limiting plate is laid on the test stand; a plurality of circular holes are formed in the limiting plate; one ball is arranged in each of the circular holes; the depth of the circular holes is smaller than the diameter of the balls; and the balls are used for supporting the glass substrate. The glasssubstrate warpage measurement base platform can be combined with a laser test head so as to continuously and equidistantly scan the glass substrate in the horizontal direction and vertical directionwith scanning step pitch dynamically adjusted. The measurement method has the advantages of simplicity, reliability, high-accuracy measurement results, low equipment processing difficulty and easinessin maintenance.

Description

technical field [0001] The invention relates to the technical field of glass substrate manufacturing, in particular to a base platform and a device for measuring warpage of a glass substrate. Background technique [0002] The warpage of the glass substrate refers to the curvature of a large area in a local area caused by the external mechanical force of the glass plate due to the large temperature difference in the same piece of glass when the glass substrate passes through the annealing point. If the warping of the glass substrate is too large, in the manufacturing process of the LCD device, the glass substrate and the negative film will not be tightly adsorbed, which will affect the pressing process, and cause uneven edges of the photolithographic pattern and a decrease in resolution, which is not conducive to the panel Manufacturers carry out large-area packaging. [0003] The glass substrate is constantly developing towards larger size and thinner, which puts higher req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/16
CPCG01B11/16
Inventor 何志锋刘琎
Owner RAINBOW (HEFEI) LIQUID CRYSTAL GLASS CO LTD
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