Device for small hole die-cutting

Abstract

A device for small hole die-cutting, which includes an upper knife plate, a lower knife plate, and an ejector plate. The upper knife plate includes a body part, a limiting part, and a cutter head. The cutter head is of the same height, and the body part and the cutter head are provided with a through waste discharge hole having the same diameter as the small hole. The lower knife plate is provided with a guide hole, and the diameter of the guide hole is smaller than the diameter of the small hole. The ejector plate is provided with a push post, the diameter of the push post is smaller than or equal to the diameter of the guide hole, and the height of the push post is greater than the thickness of the guide hole. The cutter head, the guide hole and the ejector column are arranged coaxially, and the lower cutter plate is slidably connected to the ejector plate. The device for small hole die-cutting provided by the present invention can effectively separate cut waste materials by providing a movable lower knife plate and a matching ejector pin, thereby greatly improving the processing efficiency of small hole die-cutting.

Description

technical field [0001] The invention relates to the technical field of die-cutting, in particular to a device for die-cutting small holes. Background technique [0002] Die-cutting single-layer soft and thin materials or compounding multi-layer soft and thin materials is a common die-cutting process. For example, when processing speaker mesh parts for mobile phones, the bottom paper and both sides The glue is compounded, and then the compounded two-layer structure is die-cut and punched, and then the speaker mesh is compounded on the double-sided glue of the two-layer structure that has completed the hole forming process, and the blank part preparation of the speaker mesh part is completed. [0003] figure 1 It is a schematic diagram of the structural principle of a soft and thin material that completes small hole processing; figure 2 for figure 1 Schematic diagram of the partial cross-sectional structure. see figure 1 with figure 2 As shown, in order to improve the ...

AI Technical Summary

Problems solved by technology

[0004] Since the single-layer material used for compounding is usually a light, thin, elastic and easily deformable material, and materials such as double-sided adhesive tape also have a certain viscosity, therefore, when the diameter of the small hole 100 to be processed is less than 5mm, On the one hand, the excised waste at the position of the small hole 100 is easy to stick to the body of the soft and thin material 300, and is also easy to stick and stay on the cutter. Therefore, it is necessary to design a complicated waste removal device such as a blower to remove the waste. Continue processing, which greatly affects the processing efficiency

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