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Polishing disk base, polishing disk, polishing machine and final polishing method

A polishing disc and polishing machine technology, which is applied to surface polishing machine tools, grinding/polishing equipment, and parts of grinding machine tools, etc., can solve the problem that the flatness of the wafer edge is worse than that of the middle, and overcome the flatness of the edge. The effect is worse than the intermediate flatness

Inactive Publication Date: 2019-03-22
ZING SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the deficiencies in the prior art, the present invention proposes a polishing disc base, a polishing disc, a polishing machine and a final polishing method, which can overcome the problem that the flatness of the edge of the wafer after final polishing is worse than that of the middle

Method used

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  • Polishing disk base, polishing disk, polishing machine and final polishing method
  • Polishing disk base, polishing disk, polishing machine and final polishing method
  • Polishing disk base, polishing disk, polishing machine and final polishing method

Examples

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Embodiment 1

[0050] The present invention proposes a polishing disc base, such as Figure 2A ~ Figure 2C As shown, the polishing disc base according to the present invention includes a base body 30, an inner ring portion 31 and an outer ring portion 32 concentrically arranged on a first surface of the base body 30, and an inner ring portion arranged on a second surface of the base body 30. The air flow channel 33 of the ring part and the air flow channel 34 of the outer ring part.

[0051] Wherein, for example, the base body 30 is in a circular shape, the inner ring portion 31 and the outer ring portion 32 are ring-shaped, and the inner ring portion 31 is arranged on the first surface of the base body 30 centered on the center of the base body (for example Figure 3A The front of the center), the outer ring part 32 is arranged around the edge of the base body, and is coaxial with the inner ring part 31, that is, the centers or axes of the inner ring part 31 and the outer ring part 32 are t...

Embodiment 2

[0056] The present invention proposes a polishing disc, such as Figure 4 As shown, the polishing disc comprises: a polishing disc base 40, a backing pad 46 and a carrier ring 47, the backing pad 46 is arranged between the polishing disc base 40 and the carrier ring 47, and the backing pad 46 is used for The wafer provides support, and the carrier ring 47 is used to hold the wafer. The polishing disc base 40 adopts the structure shown in Embodiment 1 of the present invention, and specifically includes a base body 41, an inner ring portion 42 and an outer ring portion 43 concentrically arranged on the first surface of the base body 41, and a second ring portion on the base body 41. The inner ring portion air flow channel 44 and the outer ring portion air flow channel 45 are arranged on the surface. When the pad base 40, backing pad 46 and carrier ring 47 are assembled together, the pad base 40 and backing pad 46 enclose a chamber, and the inner ring portion 42 divides the cham...

Embodiment 3

[0058] The present invention proposes a polishing machine for final polishing of wafers, such as Figure 5 As shown, the final polishing machine includes a polishing pad 50 and a polishing disc 51 disposed on the polishing pad 50 , wherein the polishing disc 51 adopts the structure disclosed in Embodiment 2 of the present invention, which will not be repeated here.

[0059] In this embodiment, the polishing machine includes three polishing discs, and the three polishing discs are symmetrically distributed on the polishing pad 50 . Exemplarily, when the polishing machine is working, the polishing pad 50 remains stationary, and the three polishing discs rotate on their own and rotate as planetary wheels.

[0060] According to the polishing machine of the present invention, due to the above-mentioned polishing disc, different pressures can be applied to the center area and edge area of ​​the wafer when polishing, so as to realize the change of the warped shape of the well wafer, ...

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Abstract

The invention provides a polishing disk base, a polishing disk, a polishing machine and a final polishing method. The polishing disk base comprises a base body, an inner ring part, an outer ring part,an inner ring part airflow channel and an outer ring part airflow channel, wherein the inner ring part and the outer ring part are concentrically arranged on a first surface of the base body, and theinner ring part airflow channel and the outer ring part airflow channel are arranged on a second surface of the base body. The polishing disk base can overcome the problem that after a wafer is finally polished, the edge flatness is poorer than the middle flatness. The polishing disk, the polishing machine and the final polishing method have the similar advantages.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a polishing disc base, a polishing disc, a polishing machine and a final polishing method. Background technique [0002] With the continuous development of IC (integrated circuit) technology, the semiconductor industry has higher and higher requirements for silicon wafer substrates. Among them, in order to prevent out-of-focus during exposure, the requirements for the flatness of silicon wafers have also reached an almost stringent level. Among them, the most important parameter about flatness is local flatness (SFQR). Local flatness is to divide the silicon wafer into several areas (such as 25x25mm), and calculate the flatness of each area independently. For the substrate, the local flatness at the edge of the wafer (i.e. silicon wafer substrate) is often worse than the local flatness at the center. At the same time, with the continuous pursuit of yield, the yield of chi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/04
CPCB24B29/02B24B41/04
Inventor 刘源汪燕
Owner ZING SEMICON CORP