Adhesive dispensing method of adhesive dispensing machine

Abstract

The invention discloses an adhesive dispensing method of an adhesive dispensing machine, and provides the adhesive dispensing machine. The adhesive dispensing machine comprises an adhesive dispensingbarrel, a connector fixing clamp, an adhesive dispensing machine pedestal, a control computer, a communication cable, a position camera and an optical range finder. The adhesive dispensing method comprises the following steps of: providing a needle head, and mounting the needle head on the adhesive dispensing barrel; providing adhesive-dispensed apparatuses, mounting the adhesive-dispensed apparatuses on an adhesive-dispensing pedestal, and arranging the adhesive-dispensed apparatuses in the form of an array; determining to-be-adhesive-dispensed positions of the adhesive-dispensed apparatusesby mechanically regulating and positioning or optically positioning and shooting in advance; moving a measuring point of the optical range finder to to-be-adhesive-dispensed positions of the adhesive-dispensed apparatuses; measuring height of the adhesive-dispensed positions; controlling the adhesive-dispensing barrel on the adhesive dispensing machine to transversely move to the to-be-adhesive-dispensed positions of the adhesive-dispensed apparatuses by a control system; calculating the extending dimension of the adhesive-dispensing needle head according to height of the adhesive-dispensed positions; driving the adhesive dispensing barrel to make the needle head get close to the adhesive-dispensed positions by the control system, and extending to the calculated dimension; pushing a pistonto accomplish adhesive dispensing; and continuously dispensing adhesive to accomplish adhesive dispensing of multiple arrayed adhesive-dispensed points. The adhesive dispensing method can accomplishadhesive dispensing in case of uneven height of the arrayed adhesive-dispensed points, is higher in precision, and is better in adhesive-dispensing quality.

Description

technical field [0001] The invention relates to the industry of dispensing equipment for manufacturing and packaging electronic products, in particular to a method for cleaning a dispensing needle. Background technique [0002] Adhesives used in the electronics industry are mainly used for bonding, sealing, potting, coating, structural bonding, co-lamination and SMT patching of electronic and electrical components, and are extremely versatile. Adhesives used in the electronics industry mainly include hot melt adhesives, organic silica gel, epoxy adhesives, UV adhesives, PUR adhesives, conductive adhesives, instant adhesives, polyurethane adhesives, and anaerobic adhesives. [0003] The coating of the adhesive on the device to be dispensed is mostly done by a dispenser. For multiple identical devices or multiple points of the same shape placed on the dispensing base, it is generally based on the point of the dispensed point. Dimensional accuracy is used to ensure the distanc...

AI Technical Summary

Problems solved by technology

[0003] The coating of the adhesive on the device to be dispensed is mostly done by a dispenser. For multiple identical devices or multiple points of the same shape placed on the dispensing base, it is generally based on the point of the dispensed point. Dimensional accuracy is used to ensure the distance between the dispensing needle and the dispensing position. However, due to processing reasons and placement accuracy, the height of the dispensing point on the dispensing device is often different. At this time, if you still follow the dispensing program Probing the same distance for dispensing, often there will be bubbles or inconsistent shapes of dispensing, which will affect the quality of dispensing images.

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