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Soldering paste

A solder paste and flux technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of high frequency of solder paste scraping, low product wettability, low insulation resistance value, etc. The effect of reducing the frequency of scraping solder paste, improving electrical properties, and improving insulation resistance value

Inactive Publication Date: 2019-03-26
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The frequency of the operator scraping the solder paste is high when using the traditional solder paste, and the product has low wettability and low insulation resistance value after the soldering is completed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Embodiment one, by weight ratio is 7%: 93% soldering flux and tin-based alloy powder, described soldering flux comprises the raw material of following weight percentage: thixotropic agent 6%, active agent 6%, polymerized rosin 21%, Hydrogenated rosin 8%, organic solvent is 59%, tin base alloy powder is made up of tin Sn 8%, lead Pb 90.5%, silver Ag 1.5%, thixotropic agent comprises the raw material of following weight percentage: ethylene bis stearamide 5% , high-performance amide wax micropowder 2.5%, polyamide modified hydrogenated castor oil derivative 2.5%, the mixture 90% of butyl carbitol-terpineol; Active agent comprises the raw material of following weight percent: decyl myristate 5%, 2% fluorosurfactant, 3% 2-ethylimidazole, 90% mixture of butyl carbitol-terpineol.

[0015] The preparation method comprises the following steps: first, put the above-mentioned polymerized rosin, hydrogenated rosin and organic solvent in the reaction kettle and mix them, stir and h...

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PUM

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Abstract

The invention relates to the technical field of paste welding materials, in particular to soldering paste. The soldering paste comprises scaling powder and tin-based alloy powder. The scaling powder comprises following raw materials including, by weight percent, 2%-15% of a thixotropic agent, 0%-13% of an active agent, 17%-22% of polymerized rosin, 0%-12% of hydrogenated rosin and the balance organic solvent. The thixotropic agent comprises following raw materials including, by weight percent, 0%-5% of EBS, 0%-4% of high-performance amide wax micro powder, 0%-3% of polyamide modified hydrogenated castor oil ramification and the balance butyl carbitol- terpilenol mixture. The active agent comprises following raw materials including, by weight percent, 1%-6% of decyltetradecanoicacid, 0.5%-5% of a fluorinated surfactant, 1%-5% of 2-ethyl imidazole and the balance butyl carbitol-terpilenol mixture. According to the soldering paste, the self-leveling character of the solder paste body is improved, and multi-time solder paste adhering amount consistency is improved; and wettability during welding is improved, and meanwhile the residual insulation resistance value after welding is improved as well.

Description

technical field [0001] The invention relates to the technical field of paste soldering materials, in particular to a solder paste. Background technique [0002] With the development of electronic technology, surface mount technology plays an increasingly important role in electronic assembly technology, and solder paste is the first and most important auxiliary material that develops with the development of electronic technology, especially surface mount technology. one. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. Especially with the development of electronic technology in China in recent years, in t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/262B23K35/36
Inventor 吴晶唐欣廖高兵
Owner 深圳市唯特偶新材料股份有限公司
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