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High temperature solder paste for semiconductor

A semiconductor, high-temperature welding technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of low product wettability, high frequency of scraping solder paste, low insulation resistance value, etc. Electrical properties, the effect of reducing the frequency of solder paste scraping, and improving the insulation resistance value

Active Publication Date: 2021-05-18
东莞市仁信电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is mainly used for the welding of electronic components such as PCB surface resistance, capacitor and IC in the SMT industry. With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. However, when using traditional solder paste, the operator's The frequency of scraping solder paste is high, and the product has low wettability and low insulation resistance value after soldering

Method used

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  • High temperature solder paste for semiconductor

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Comparison scheme
Effect test

Embodiment 1

[0022] High-temperature solder paste for semiconductors, composed of flux and tin-based alloy powder with a weight ratio of 10%:90%, the flux includes the following raw materials in percentage by weight: thixotropic agent 4%, active agent 4%, polymerized rosin 20% %, hydrogenated rosin 10%, organic solvent is 62%, tin base alloy powder is made up of tin Sn 5%, lead Pb 92.5%, silver Ag 2.5%, thixotropic agent comprises the raw material of following weight percentage: ethylene bis stearamide 1%, high-performance amide wax micropowder 2%, polyamide-modified hydrogenated castor oil derivative 1%, the mixture 96% of butyl carbitol-terpineol; Active agent comprises the raw material of following percentage by weight: decyldecyl Tetraacid 2%, fluorosurfactant 0.5%, 2-ethylimidazole 2%, butyl carbitol-terpineol mixture 95.5%;

[0023] The preparation method comprises the following steps:

[0024] S1. Put the above-mentioned polymerized rosin, hydrogenated rosin and organic solvent in ...

Embodiment 2

[0029] High-temperature solder paste for semiconductors, composed of flux and tin-based alloy powder with a weight ratio of 13%:87%, the flux includes the following raw materials in percentage by weight: thixotropic agent 10%, active agent 10%, polymerized rosin 22 %, hydrogenated rosin 11%, organic solvent is 57%, tin base alloy powder is made up of tin Sn 5%, lead Pb 92.5%, silver Ag 2.5%, thixotropic agent comprises the raw material of following weight percent: ethylene bis stearamide 3%, high-performance amide wax micropowder 4%, polyamide-modified hydrogenated castor oil derivative 3%, the mixture of butyl carbitol-terpineol has 90%; Active agent comprises the raw material of following percentage by weight: decyl Myristic acid 5%, fluorosurfactant 1.2%, 2-ethylimidazole 4%, butyl carbitol-terpineol mixture 89.8%;

[0030] The preparation method comprises the following steps:

[0031] S1. Put the above-mentioned polymerized rosin, hydrogenated rosin and organic solvent in...

Embodiment 3

[0036] High-temperature solder paste for semiconductors, composed of flux and tin-based alloy powder with a weight ratio of 15%:85%, the flux includes the following raw materials in percentage by weight: thixotropic agent 16%, active agent 16%, polymerized rosin 25% %, hydrogenated rosin 13%, organic solvent 30%, tin base alloy powder is made up of tin Sn 5%, lead Pb 92.5%, silver Ag 2.5%, thixotropic agent comprises the raw material of following weight percentage: ethylene bis stearamide 6 %, high-performance amide wax micropowder 5%, polyamide-modified hydrogenated castor oil derivative 5%; active agent comprises the raw material of following percentage by weight: decyl tetradecanoic acid 8%, fluorosurfactant 2%, 2-ethane 6% imidazole, 84% mixture of butyl carbitol-terpineol;

[0037] The preparation method comprises the following steps:

[0038] S1. Put the above-mentioned polymerized rosin, hydrogenated rosin and organic solvent in the weight percentage and mix them in a ...

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Abstract

High-temperature solder paste for semiconductors, including flux and tin-based alloy powder, the flux includes the following raw materials: thixotropic agent, active agent, polymerized rosin, hydrogenated rosin, and the balance is an organic solvent; the thixotropic agent includes the following raw materials : ethylene bis stearamide, high-performance amide wax micropowder, polyamide modified hydrogenated castor oil derivatives, and the balance is the mixture of butyl carbitol-terpineol; the active agent includes the following raw materials: decyl Myristic acid, fluorosurfactant, 2‑ethylimidazole, the balance is a mixture of butyl carbitol‑terpineol. In the present invention, by adjusting the components in the thixotropic agent, the self-leveling properties of the solder paste body are improved, the frequency of scraping the solder paste by the operator is reduced, the consistency of the amount of solder paste is improved for multiple times, and the moisturization during soldering is improved. Moisture also improves the residual insulation resistance value after welding, thereby improving the electrical performance of customers' products.

Description

technical field [0001] The invention relates to the technical field of paste soldering materials, in particular to a special high-temperature solder paste for semiconductors. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for the welding of electronic components such as PCB surface resistance, capacitor and IC in the SMT industry. With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. However, when using traditional solder paste, the operator's The frequency of scraping solder paste is high, and the product has low wettability and low insulation resistance value after soldering. Contents of the invention [0003] The object of the present invention is to solve the shortcomings in the prior art, and propos...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/26B23K35/40
CPCB23K35/268B23K35/3612B23K35/362B23K35/40
Inventor 许卓平
Owner 东莞市仁信电子有限公司
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