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High temperature soldering paste special for semiconductors

A high-temperature soldering and semiconductor technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of high frequency of solder paste scraping, low insulation resistance value, low product wettability, etc., to reduce the The frequency of scraping solder paste, the effect of improving insulation resistance value and improving electrical performance

Active Publication Date: 2018-09-18
东莞市仁信电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is mainly used for the welding of electronic components such as PCB surface resistance, capacitor and IC in the SMT industry. With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. However, when using traditional solder paste, the operator's The frequency of scraping solder paste is high, and the product has low wettability and low insulation resistance value after soldering

Method used

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  • High temperature soldering paste special for semiconductors

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Effect test

Embodiment 1

[0022] High-temperature solder paste for semiconductors, composed of flux and tin-based alloy powder with a weight ratio of 10%:90%, the flux includes the following raw materials in percentage by weight: thixotropic agent 4%, active agent 4%, polymerized rosin 20% %, hydrogenated rosin 10%, organic solvent is 62%, tin base alloy powder is made up of tin Sn 5%, lead Pb 92.5%, silver Ag 2.5%, thixotropic agent comprises the raw material of following weight percentage: ethylene bis stearamide 1%, high-performance amide wax micropowder 2%, polyamide-modified hydrogenated castor oil derivative 1%, the mixture 96% of butyl carbitol-terpineol; Active agent comprises the raw material of following percentage by weight: decyldecyl Tetraacid 2%, fluorosurfactant 0.5%, 2-ethylimidazole 2%, butyl carbitol-terpineol mixture 95.5%;

[0023] The preparation method comprises the following steps:

[0024] S1. Put the above-mentioned polymerized rosin, hydrogenated rosin and organic solvent in ...

Embodiment 2

[0029] High-temperature solder paste for semiconductors, composed of flux and tin-based alloy powder with a weight ratio of 13%:87%, the flux includes the following raw materials in percentage by weight: thixotropic agent 10%, active agent 10%, polymerized rosin 22 %, hydrogenated rosin 11%, organic solvent is 57%, tin base alloy powder is made up of tin Sn 5%, lead Pb 92.5%, silver Ag 2.5%, thixotropic agent comprises the raw material of following weight percent: ethylene bis stearamide 3%, high-performance amide wax micropowder 4%, polyamide-modified hydrogenated castor oil derivative 3%, the mixture of butyl carbitol-terpineol has 90%; Active agent comprises the raw material of following percentage by weight: decyl Myristic acid 5%, fluorosurfactant 1.2%, 2-ethylimidazole 4%, butyl carbitol-terpineol mixture 89.8%;

[0030] The preparation method comprises the following steps:

[0031] S1. Put the above-mentioned polymerized rosin, hydrogenated rosin and organic solvent in...

Embodiment 3

[0036] High-temperature solder paste for semiconductors, composed of flux and tin-based alloy powder with a weight ratio of 15%:85%, the flux includes the following raw materials in percentage by weight: thixotropic agent 16%, active agent 16%, polymerized rosin 25% %, hydrogenated rosin 13%, organic solvent 30%, tin base alloy powder is made up of tin Sn 5%, lead Pb 92.5%, silver Ag 2.5%, thixotropic agent comprises the raw material of following weight percent: ethylene bis stearamide 6 %, high-performance amide wax micropowder 5%, polyamide-modified hydrogenated castor oil derivative 5%; active agent comprises the raw material of following percentage by weight: decyl tetradecanoic acid 8%, fluorosurfactant 2%, 2-ethane 6% imidazole, 84% mixture of butyl carbitol-terpineol;

[0037] The preparation method comprises the following steps:

[0038] S1. Put the above-mentioned polymerized rosin, hydrogenated rosin and organic solvent in the weight percentage and mix them in a rea...

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Abstract

The invention relates to high temperature soldering paste special for semiconductors. The high temperature soldering paste comprises scaling powder and tin-based alloy powder, and the scaling powder comprises the following raw materials including a thixotropic agent, an active agent, polymerized rosin, hydrogenated rosin and the balance organic solvent; the thixotropic agent comprises the following raw materials including ethylene bis stearamide, high-performance amide wax powder, polyamide modified hydrogenated castor oil derivatives and the balance butyl carbitol-terpilenol mixture; and theactive agent comprises the following raw materials including decyl tetradecanoic acid, a fluorinated surfactant, 2-ethylimidazole and the balance butyl carbitol-terpilenol mixture. According to the high temperature soldering paste, the components in the thixotropic agent are adjusted, and therefore the self-leveling characteristic of the soldering paste is improved, the soldering paste scrapping frequency of an operator is reduced, the repeated soldering paste adhering coincidence is improved, the welding wettability is improved, the rudimental insulation resistance value after welding is improved, and the client product electrical property is improved.

Description

technical field [0001] The invention relates to the technical field of paste soldering materials, in particular to a special high-temperature solder paste for semiconductors. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for the welding of electronic components such as PCB surface resistance, capacitor and IC in the SMT industry. With the rapid development of the modern electronics industry, solder paste is an important production link for the welding of electronic products. However, when using traditional solder paste, the operator's The frequency of scraping solder paste is high, and the product has low wettability and low insulation resistance value after soldering. Contents of the invention [0003] The object of the present invention is to solve the shortcomings in the prior art, and propos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/26B23K35/40
CPCB23K35/268B23K35/3612B23K35/362B23K35/40
Inventor 许卓平
Owner 东莞市仁信电子有限公司
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