30results about How to "Improve the insulation resistance value" patented technology

The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion migration even in high temperatures and highly humid environments. The printed wiring board has a circuit comprising a metal conductor on base metal layers created by forming an insulating resin layer 4 on at least one face of an insulating substrate 1 and forming the base metal layers 2 and 5 on the insulating resin layer. In the printed wiring board, at least a part of an upper face of the insulating resin layer existing in spaces 11 between the metal conductors is formed at a position lower than the interface between the base metal layer 5 and the insulating resin layer 4.

A manufacturing method of conductive paste comprising arranging process (S20 to S23) of ceramics particles, arranging process (S10 to S14) of wetted metal particles, forming process (S30) of slurry wherein metal particles and ceramics particles are mixed and dispersion treatment process (S32) by applying collision to the slurry. The arranging process of wetted metal particles comprises, a process (S12) of adding solvent, compatible with organic component in conductive paste and incompatible with water, to undried water washed metal particles, a process (S18) of adding surfactant, a process (S14) of separating water from the metal particles and a process (S15) of adding acetone or the other second solvent.

The invention discloses a three-column amorphous iron core with a pulling plate. The three-column amorphous iron core with the pulling plate comprises an amorphous iron core body and the pulling plate, wherein the amorphous iron core body comprises an outer frame iron core and two inner frame iron cores which are of an integral structure. The three-column amorphous iron core with the pulling plate also comprises a grid cloth plate and a composite membrane plate which are arranged between the amorphous iron core body and the pulling plate, wherein the grid cloth plate and the composite membrane plate keep away from a lap joint port of the amorphous iron core body, and the amorphous iron core body, the grid cloth plate, the composite membrane plate and the pulling plate are integrally cured through epoxy resin. The invention also discloses a manufacturing method of the three-column amorphous iron core with the pulling plate. According to the three-column amorphous iron core with the pulling plate, disclosed by the invention, the outer frame iron core and the inner frame iron cores are integrally formed before annealing, and then the fragment amount in a follow-up assembling process is reduced, so that the no-load loss and noise of a transformer are effectively reduced. By additionally arranging the grid cloth plate and the composite membrane plate, the insulation resistance value of the transformer can be effectively increased, and the stability of the transformer can be guaranteed.

A dielectric ceramic composition including a first component and a second component. The first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %. The second component includes (by mass) at least (a) an oxide of Mn of 0.005% to 3.500% by mass and (b) one or both of an oxide of Cu of 0.080% by mass to 20.000% and an oxide of Ru of 0.300% to 45.000%.

A dielectric ceramic composition comprises a first ingredient and a second ingredient. The first ingredient comprises 0.00 to 35.85% by mole of an oxide of Ca, 0.00 to 47.12% by mole of an oxide of Sr, 0.00 to 51.22% by mole of an oxide of Ba, 0.00 to 17.36% by mole of an oxide of Ti, 0.00 to 17.36% by mole of an oxide of Zr, 0.00 to 2.60% by mole of an oxide of Sn, 0.00 to 35.32% by mole of an oxide of Nb, 0.00 to 35.32% by mole of an oxide of Ta, and 0.00 to 2.65% by mole of an oxide of V. As the second ingredient, the dielectric ceramic composition comprises at least 0.005 to 3.500% by massof an oxide of Mn (a); and 0.080 to 20.000% by mass of an oxide of Cu and / or 0.300 to 45.000% by mass of an oxide of Ru (b). According to the present invention, the dielectric ceramic composition canbe provided, wherein changes in the electrostatic capacity are small even under a high-temperature environment, dielectric losses at 25 DEG C and 200 DEG C are small, and the insulation resistance value under a high-temperature environment is high.

The invention relates to a docking method of a 10 kV crosslinked polyethylene cable. The docking method comprises the specific steps of firstly aligning two sections of cables which need to be in butt joint, stripping cable outer protective sleeves, steel armor layers and inner protective layers in sequence from all ports, and taking down cable filling materials; sleeving one end of the cable with a radioactive heat shrink tube for use after cable butt joint manufacturing is completed; then stripping copper shielding layers and semi-conductive layers in sequence from all the ports; measuring the length of a copper pressed connecting tube which is connected with the cable cores, adopting 1 / 2 of the length of the cable core and adding 5 mm on the length, which is a basis that main insulation parts of the cables which needs to be stripped are exposed out of the conductive cores, according to the length, stripping cable main insulation layers from the ports, cutting the main insulation fractures into pencil tip shapes with the length of 60 mm, and making an inner semi-conductive layers with the length of 5mm exposed; connecting the conductive cores; finally using the sleeved outer protective sleeve radioactive heat shrinkage tube to conduct uniform covering and heat shrinkage on the outer protective sleeve at the middle joint. Compared with a traditional method, the docking method of the 10 kV crosslinked polyethylene cable has superior moisture resistance, waterproofness and insulating properties.

The invention discloses an iron-based powder core magnet and a manufacturing method thereof. The manufacturing method includes the following steps of S1, placing the iron-based powder core magnet in an organic carbon source steam atmosphere, processing the iron-based powder core magnet for 1 hour to 5 hours under the conditions that the temperature T1 is higher than 100 DEG C but lower than or equal to 500 DEG C, the intensity of pressure is 1-20 MPa and the carbon potential is controlled to be 0.4-2.0%, and making the surface of the iron-based powder core magnet adsorb active carbon atoms; taking out the iron-based powder core magnet after waiting for the iron-based powder core magnet to be cooled to room temperature, then placing the iron-based powder core magnet in an inert gas atmosphere, processing the iron-based powder core magnet for 1 hour to 6 hours under the condition that the temperature T2 is higher than 500 DEG C but lower than or equal to 900 DEG C, and making the adsorbed active carbon atoms on the surface permeate into the iron-based powder core magnet; S2, immersing the iron-based powder core magnet into fast quenching oil and completing quenching under the condition of 70+ / -10 DEG C; and S3, rinsing the iron-based powder core magnet, and then performing drying treatment operation. The obtained iron-based powder core magnet has higher insulation and pressure-tolerant characteristics and the manufacturing method can realize mass production.

The invention relates to an integrated insulating joint. The joint comprises a left steel short pipe, a right steel short pipe, a left flange, a right flange, a joint sleeve, a first insulated sealing piece, a second insulated sealing piece, an insulated filling material and an insulated sealing ring, wherein an external thread is formed in the outer wall of the left steel short pipe; an internal thread is formed in the inner wall of the left flange; the external thread formed in the outer wall of the left steel short pipe and the internal thread formed in the inner wall of the left flange are matched to form a fixed connection mode; the threads through which the left steel short pipe and the left flange are in threaded connection are matched at the two starting ends so as to realize angle joint structure welding; an external thread is formed in the outer wall of the right steel short pipe; an internal thread is formed in the inner wall of the right flange; the external thread formed in the outer wall of the right steel short pipe and the internal thread formed in the inner wall of the right flange are matched to form a fixed connection mode; and the threads through which the right steel short pipe and the right flange are in threaded connection are matched at the two starting ends so as to realize angle joint structure welding. The yield of the finished product is high, the production cost can be greatly reduced, the production period is shortened, the joint is safe, and the standard specification is met.

High-temperature solder paste for semiconductors, including flux and tin-based alloy powder, the flux includes the following raw materials: thixotropic agent, active agent, polymerized rosin, hydrogenated rosin, and the balance is an organic solvent; the thixotropic agent includes the following raw materials : ethylene bis stearamide, high-performance amide wax micropowder, polyamide modified hydrogenated castor oil derivatives, and the balance is the mixture of butyl carbitol-terpineol; the active agent includes the following raw materials: decyl Myristic acid, fluorosurfactant, 2‑ethylimidazole, the balance is a mixture of butyl carbitol‑terpineol. In the present invention, by adjusting the components in the thixotropic agent, the self-leveling properties of the solder paste body are improved, the frequency of scraping the solder paste by the operator is reduced, the consistency of the amount of solder paste is improved for multiple times, and the moisturization during soldering is improved. Moisture also improves the residual insulation resistance value after welding, thereby improving the electrical performance of customers' products.

The invention discloses a method for improving the insulation resistance value of a chip capacitor, which includes: loading a constant voltage on the chip capacitor; heating up to a preset temperature in an annealing furnace and keeping it for a preset time; placing the chip capacitor in liquid nitrogen Cool for 1-3 minutes; then take out the chip capacitor and let it rise to room temperature naturally in the air. This method utilizes the characteristic that the insulation resistance value of the STO chip capacitor increases continuously with the load voltage and time, and performs rapid heat treatment on the chip capacitor under the condition of the loaded voltage. This method is simple and easy to implement. Without changing the capacitance value, loss and capacitance temperature coefficient of the capacitor, the insulation resistance value and consistency of the STO ceramic chip are greatly improved. After removing the applied voltage and thermal conditions, the STO chip capacitor is insulated The resistance value does not decay over time.

A ferrite substrate for thin-film inductors is provided by means of blending raw materials to meet a composition of di-iron trioxide (Fe2O3): 40 to 55 mol %, nickel oxide (NiO): 5 to 35 mol %, zinc oxide (ZnO): 10 to 40 mol %, and bismuth trioxide (Bi2O3): 150 to 750 ppm, or of Fe2O3: 40 to 55 mol %, NiO: 5 to 35 mol %, ZnO: 10 to 40 mol %, cupric oxide (CuO): 5 to 10 mol %, and manganese dioxide (MnO2): 0.5 to 2 mol %, and then molding and sintering the blended material, and applying hot isostatic pressing to the sintered article. A thin-film common mode filter and a thin-film common mode filter array using the ferrite substrate and the manufacturing method of the substrate are also provided.

The present invention relates to a method for improving the insulation performance of a large-scale motor on site, comprising: S010, a current drying step, starting a drying power supply, applying a current to the winding inside the motor from the drying power supply, and the time for continuously applying the current is A hours; S020, Pass hot air through the upper tuyere of the motor, and discharge the hot air through the winding inside the motor from the lower tuyere; S030, pass hot air through the lower tuyere of the motor, and discharge the hot air through the winding inside the motor from the upper tuyere. In the present invention, under the condition that the motor is not disassembled, the electric current heating step and the hot air drying step are performed on the inner winding of the motor to realize drying inside the motor, thereby improving the insulation performance of the motor.