Distributing base board and electronic device using it

Abstract

The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion migration even in high temperatures and highly humid environments. The printed wiring board has a circuit comprising a metal conductor on base metal layers created by forming an insulating resin layer 4 on at least one face of an insulating substrate 1 and forming the base metal layers 2 and 5 on the insulating resin layer. In the printed wiring board, at least a part of an upper face of the insulating resin layer existing in spaces 11 between the metal conductors is formed at a position lower than the interface between the base metal layer 5 and the insulating resin layer 4.

Description

technical field [0001] The present invention relates to electronic devices such as a wiring board, a semiconductor device using the same, and a multi-chip module. Background technique [0002] In recent years, electronic devices such as mobile phones, portable information terminals, notebook personal computers, digital cameras, video cameras, etc. have been increasingly reduced in size, weight, and performance. As a result, it is used in semiconductor devices such as BGA (ball grid array) / CSP (chip size package) that use this wiring board to fix and support their electronic components, wiring boards that form circuits, and multi-chip modules. Further densification is also required. [0003] In order to cope with this increase in density, composite substrates, glass substrates, etc. have been proposed and put into practical use. [0004] As an example of these wiring boards, Figure 9 A schematic cross-sectional view showing a wiring board in which a two-layer wiring patter...

AI Technical Summary

Problems solved by technology

As a result, deterioration phenomena called current leakage and short circuit occur between wiring

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