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Conductive composition mfg. method and conductive paste mfg. method

A manufacturing method and composition technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, conductive adhesives, cable/conductor manufacturing, etc., can solve the problem of mixing metal particle metal particle slurry and ceramic particle slurry Insufficient dispersion, hindering the improvement of the yield of electronic components, and the inability to disperse metal particles, etc., to achieve the effects of prolonging life, less short-circuit defects, and high insulation resistance

Inactive Publication Date: 2004-10-06
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the conventional dispersion method has the following problems: the dispersion of the metal particles, the mixing and dispersion of the metal particle slurry and the ceramic particle slurry are insufficient, and the electrode film formed by the conductive paste obtained by the conventional method has a problem of film thickness. Insufficient uniformity hinders the improvement of the yield of electronic components
[0009] In addition, depending on the method of wetting the metal particles, the aggregation of the metal particles can be prevented, but the metal particles cannot be highly dispersed

Method used

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  • Conductive composition mfg. method and conductive paste mfg. method
  • Conductive composition mfg. method and conductive paste mfg. method
  • Conductive composition mfg. method and conductive paste mfg. method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] Ni metal particles having an average particle diameter of 0.4 μm obtained by the gas phase chemical reaction method were washed with water. After washing with water, a slurry containing Ni metal particles and water was obtained. This slurry contained 80 parts by weight of water with respect to 100 parts by weight of Ni metal particles.

[0085] With this slurry, 3 to 30 parts by weight of terpineol as a solvent and 0.05 to 10.0 parts by weight of a cationic surfactant were mixed and stirred. The Ni metal particles are deposited and separated from the water. 0.3 to 30 parts by weight of acetone as a second solvent is added to the separated Ni metal particles, and the added acetone is evaporated together with water to remove water adhering to the Ni metal particles. Ni metal particles are covered and wetted by terpineol and / or surfactant. The average particle diameter of the obtained Ni metal particles was 0.4 μm.

[0086] To 100 parts by weight of the slurry, 50 wt% ...

Embodiment 2

[0094] The sheet of Example 2 was produced in the same manner as in Example 1 except that the pressure at the time of impact dispersion was different. The pressure at the time of the impact dispersion of Example 2 is 9.8×10 7 Pa(1000kgf / cm 2 ).

Embodiment 3

[0100] The flakes of Example 3 were produced in the same manner as in Example 1 except that the pressure at the time of impact dispersion was different. The pressure at the time of the impact dispersion of Example 3 is 1.96×10 7 Pa(200kgf / cm 2 ).

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Abstract

A manufacturing method of conductive paste comprising arranging process (S20 to S23) of ceramics particles, arranging process (S10 to S14) of wetted metal particles, forming process (S30) of slurry wherein metal particles and ceramics particles are mixed and dispersion treatment process (S32) by applying collision to the slurry. The arranging process of wetted metal particles comprises, a process (S12) of adding solvent, compatible with organic component in conductive paste and incompatible with water, to undried water washed metal particles, a process (S18) of adding surfactant, a process (S14) of separating water from the metal particles and a process (S15) of adding acetone or the other second solvent.

Description

technical field [0001] The present invention relates to a method for producing a conductive composition and a conductive paste used in electronic components with a laminated structure. Background technique [0002] Along with the miniaturization of electronic equipment, electronic components such as inductors, capacitors, and filters used in them are also required to be further miniaturized. In order to achieve miniaturization of electronic components while maintaining electrical characteristics, the conductive film must be smooth and completely free of pinholes, and the metal particles contained in the conductive composition are required to be miniaturized and highly dispersed. This is because agglomerated metal particles or deformed metal particles are contained in the conductive paste forming the internal electrodes of the ceramic laminate, causing electrical problems such as short circuits. In particular, in thin-layer multilayer electronic components, higher miniaturiz...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01F23/47C22C1/10H01B1/16H01B1/22H01B13/00H01G4/008H01G4/12
CPCH01G4/0085H01B1/16Y10T428/2982H01B1/22Y10T428/2991C22C1/1084H05K1/092H01G4/30
Inventor 小田和彦丸野哲司佐佐木昭田中公二
Owner TDK CORPARATION
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