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Spot coating type high-temperature soldering paste and preparation method thereof

A high-temperature welding and spot-coating technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of crusting on the surface, high welding temperature, and blackening of residues, so as to achieve less residues, excellent electrical properties, Corrosion reduction effect

Inactive Publication Date: 2011-05-11
东莞市特尔佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with solder paste of other alloys, dispensing high-temperature alloy solder paste has higher soldering temperature, higher specificity, and tin is sprayed out by air pressure extrusion, while the existing solder paste will harden and stratify during storage , After being in contact with the air for a long time, there will be skinning on the surface. During use, the impact and heat will be generated due to the frequent extrusion of the air pressure, which will also easily lead to the deterioration of the solder paste. voids, blackening of residues,

Method used

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  • Spot coating type high-temperature soldering paste and preparation method thereof

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Effect test

Embodiment 1

[0033] A spot-coated high-temperature solder paste, which is composed of flux and tin-based alloy powder, flux raw materials: polymerized rosin 30g, hydrogenated rosin 15g, modified hydrogenated castor oil 2g, hydrogenated castor oil wax 3g, succinic anhydride 3g , 2 g of stearic acid, 1 g of hydroquinone, 1 g of ethylene bis stearic acid amide, 13 g of diethylene glycol monobutyl ether, and 30 g of ethylene glycol hexyl ether.

[0034] Preparation method: Mix 30g of polymerized rosin, 15g of hydrogenated rosin, 13g of diethylene glycol monobutyl ether, and 30g of ethylene glycol hexyl ether, stir and heat to 145°C for dissolution, then add 1g of hydroquinone, 2g of modified hydrogenated Castor oil, 3g hydrogenated castor oil wax and 1g ethylene bisstearic acid amide, add 3g succinic anhydride, 2g stearic acid after completely dissolving, after the above materials are completely dissolved, cool, and cool to room temperature to obtain flux, take 12g of flux and 88g of Sn5 / Pb92....

Embodiment 2

[0036] A spot-coated high-temperature solder paste, which is composed of flux and tin-based alloy powder, flux raw materials: polymerized rosin 32g, hydrogenated rosin 12g, modified hydrogenated castor oil 3g, hydrogenated castor oil wax 2g, succinic anhydride 3g , 3 g of dimer acid, 1 g of hydroquinone, 1 g of ethylene bisstearic acid amide, 13 g of diethylene glycol monobutyl ether, and 30 g of diethylene glycol monohexyl ether.

[0037] Preparation method: Mix 32g of polymerized rosin, 12g of hydrogenated rosin, 13g of diethylene glycol monobutyl ether, and 30g of diethylene glycol monohexyl ether, stir and heat to 145°C for dissolution, then add 1g of hydroquinone, 3g of modified Hydrogenated castor oil, 2g hydrogenated castor oil wax and 1g ethylene bis stearic acid amide, add 3g succinic anhydride after dissolving completely, 3g dimer acid, cool after above material dissolves completely, cool to room temperature to obtain flux, Take 11g of flux and 89g of Sn5 / Pb92.5 / Ag2....

Embodiment 3

[0039] A spot-coated high-temperature solder paste, which is composed of flux and tin-based alloy powder, flux raw materials: polymerized rosin 35g, hydrogenated rosin 12g, modified hydrogenated castor oil 2g, hydrogenated castor oil wax 2g, phthalene 3g of acid anhydride, 3g of dimer acid, 2g of hydroquinone, 1g of ethylene bisstearic acid amide, 15g of diethylene glycol monobutyl ether, and 25g of diethylene glycol monohexyl ether.

[0040] Preparation method: Mix 35g of polymerized rosin, 12g of hydrogenated rosin, 15g of diethylene glycol monobutyl ether, 25g of diethylene glycol monohexyl ether, stir and heat to 145°C for dissolution, then add 2g of hydroquinone, 2g of modified Hydrogenated castor oil, 2g hydrogenated castor oil wax and 1g ethylene bis stearic acid amide, after completely dissolving, add 3g phthalic anhydride, 3g dimer acid, cool after the above materials are completely dissolved, and cool to room temperature to obtain auxiliary Soldering flux, take 13g o...

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Abstract

The invention belongs to the technical field of soldering paste, and particularly relates to high-temperature soldering paste used for spot coating type operation and a preparation method of the high-temperature soldering paste. The high-temperature soldering paste comprises soldering flux and Sn / Pb / Ag tin-based alloy powders distributed in the soldering flux; the soldering flux includes the following components by weight percentage: 30 to 40 percent of polymerized rosin, 8 to 15 percent of hydrogenated rosin, 2 to 4 percent of modified hydrogenated castor oil, 2 to 4 percent of hydrogenated castor oil wax, 5 to 6 percent of active agent, 1 to 2 percent of hydroquinone, 1 to 2 percent of ethylene bis stearamide, and solvent; and the soldering paste adopts a syringe type package and is prepared through vacuumizing defoaming process and other process. The soldering paste has the advantages of stable performance, uniform spot coating, no phenomena of hardening and layering during the storage, no phenomenon of surface crusting on the surface in contact with air, long storage life and service life, good expansion rate and good insulation resistance; and particularly, residues after reflow soldering at the high temperature above 340 DEG C is unsintered and is easy to clean.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a high-temperature solder paste for spot coating operation and a preparation method thereof. Background technique [0002] High-temperature solder paste generally refers to the solder paste of Sn5 / Pb92.5 / Ag2.5 alloy. It is mainly used in the packaging and welding of semiconductor devices such as power tubes, thyristors, and rectifiers, as well as high-temperature soldering processes and high-temperature work such as multilayer circuit boards. Welding of the components under it, etc. Compared with solder paste of other alloys, dispensing high-temperature alloy solder paste has higher soldering temperature, higher specificity, and tin is sprayed out by air pressure extrusion, while the existing solder paste will harden and stratify during storage , After being in contact with the air for a long time, there will be skinning on the surface. During use, the impact and heat will ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/362H05K3/12
Inventor 陈东明郑伟民邓小成
Owner 东莞市特尔佳电子有限公司
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