Preparation process for carbon film tin-sprayed printed circuit board
A technology of printed circuit board and preparation process, which is applied in the direction of printed circuit manufacturing, printed circuit, and secondary treatment of printed circuit, etc. Curing effect and other issues
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[0050] In order to make the technical solution of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings. Any solution obtained by equivalent replacement of the technical features of the technical solution of the present invention and conventional reasoning shall fall into the protection scope of the present invention.
[0051] A preparation process of a carbon film tin spray printed circuit board, the steps are as follows:
[0052] (1) Pretreatment: Before solder mask and carbon film printing, the copper substrate is cleaned by mechanical brushing and roughening cleaning machine;
[0053] (2) Preparation of printing screen: 220 mesh acrylic screen, coated with 30um thickness sealing glue;
[0054] (3) Printing solder mask: printing ink on the printing screen; then printing the printing screen with printing ink on the copper substrate; after the copper substrate is printed, solder mask characters;
[0055] (4) C...
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