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No-wash halogen-free flux and low-temperature soldering tin wire

A low-temperature soldering and flux technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of needing cleaning process, high cost, unfavorable environment, etc.

Inactive Publication Date: 2017-01-04
工业和信息化部电子第五研究所华东分所
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] CN102000927A discloses a lead-free solder paste, which is formed by mixing 8-20% flux and 80-92% SnAgCu series solder powder based on the weight of the solder paste, and the flux contains 38-44% rosin, 6.5-7.0% active agent, 41-45% organic solvent and 2.4-7.0% thixotropic agent; the active agent consists of halogen-containing compound salt, binary organic acid and alcohol amine salt Composition; the organic solvent is composed of a high boiling point solvent >220°C and a low boiling point solvent <220°C; the thixotropic agent is composed of polyamide, hydrogenated castor oil, fatty acid glyceride, N,N-ethylene One or two compositions of bis stearic acid amides; the SnAgCu series solder powder is based on its weight and is composed of 96.5-99.0% Sn powder, 0.3-3.0% Ag powder and 0.5-0.7% Cu powder. Good welding performance, printing performance and spreadability, less residue after welding, but its raw materials contain halogen compounds, which is not good for the environment, requires cleaning process after welding, and the cost is high
The lead-free paste soldering material of the present invention does not contain halogen, has no peculiar smell, and has good formability of solder joints. Low, the required welding material has a low melting point, and the application of welding materials with too high melting point is limited

Method used

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  • No-wash halogen-free flux and low-temperature soldering tin wire
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  • No-wash halogen-free flux and low-temperature soldering tin wire

Examples

Experimental program
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Effect test

Embodiment 1

[0053] 1) Preparation of no-clean halogen-free flux: by weight percentage, the following raw materials were weighed: 20% phenolic resin, 12% acrylic resin, 61% isopropanol, 1% malic acid, 1.5% salicylic acid acid, 1.5% succinic acid, 1.5% adipic acid, 0.5% alkylphenol ethoxylates, 0.3% hydrogenated castor oil, 0.5% tolyltriazole and 0.2% menthol , in which phenolic resin and acrylic resin form a synthetic resin, and malic acid, salicylic acid, succinic acid and adipic acid are compounded to form an organic acid activator; the above raw materials are mixed to prepare a no-clean halogen-free flux.

[0054] 2) Preparation of low-temperature solder wire: by weight percentage, the SnAgBi alloy is prepared as raw material with 0.5% Ag, 44.5% Bi and the Sn of the balance; ) prepared 2% no-cleaning halogen-free flux as raw material to prepare low-temperature solder wire.

Embodiment 2

[0056] 1) Preparation of no-clean halogen-free soldering flux: by weight percentage, take the following raw materials: 20% phenolic resin, 15% vinyl chloride resin, 58% isopropanol, 0.8% citric acid, 1.5% trans Oleic acid, 1.5% succinic acid, 1.5% benzoic acid, 0.5% octylphenol ethoxylate, 0.4% polyamide wax, 0.6% benzotriazole and 0.2% menthol, phenolic Resin and vinyl chloride resin form a synthetic resin, and citric acid, elaidic acid, succinic acid and benzoic acid are compounded to form an organic acid activator; the above raw materials are mixed to prepare a non-cleaning halogen-free flux.

[0057] 2) Preparation of low-temperature solder wire: by weight percentage, the SnAgBi alloy is prepared as raw material with 0.5% Ag, 63.5% Bi and the Sn of the balance; ) prepared 2.2% no-clean halogen-free flux as raw material to prepare low-temperature solder wire.

Embodiment 3

[0059] 1) Preparation of no-clean halogen-free flux: by weight percentage, the following raw materials were weighed: 12% polyurethane, 15% phenolic resin, 65% isopropanol, 0.8% glutaric acid, 1.8% butanediol acid, 1.8% malic acid, 1.1% benzoic acid, 0.8% sorbitan monolaurate, 0.4% hydrogenated castor oil, 0.6% benzotriazole and 0.7% hexamethylenediamine, of which Polyurethane and phenolic resin form a synthetic resin, and glutaric acid, succinic acid, malic acid and benzoic acid are compounded to form an organic acid activator; the above raw materials are mixed to prepare a no-cleaning halogen-free flux.

[0060] 2) Preparation of low-temperature solder wire: by weight percentage, the SnAgBi alloy is prepared as raw material with 2.5% Ag, 55.5% Bi and the Sn of the balance; ) prepared 2% no-cleaning halogen-free flux as raw material to prepare low-temperature solder wire.

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Abstract

The invention discloses a no-wash halogen-free flux and low-temperature soldering tin wire. The no-wash halogen-free flux is prepared from, by weight, 20-30% of film forming matter, 40-70% of solvent, 2-7% of activator, 0.1-1% of surface active agent, and 0.5-3% of additive. The no-wash halogen-free flux does not contain halogen compounds and is environmentally friendly; the composition proportion of the film forming matter, the solvent, the activator, the surface active agent, and the additive in the raw materials is adjusted, so that the activity of the no-wash halogen-free flux is high, less residue is left after welding, a cleaning process after welding is not required, and the insulation resistance value of components and parts after welding is remarkably increased. In addition, compared with traditional lead-free solder, the low-temperature soldering tin wire has lower melting point, practicability of manual welding is high, welding spots are smooth and attractive, and the low-temperature soldering tin wire can be widely used in welding of thermal sensing elements.

Description

technical field [0001] The invention relates to the technical field of flux, in particular to a non-cleaning halogen-free flux and low-temperature solder wire. Background technique [0002] Solder wire is usually composed of tin alloy and flux. The flux can improve the auxiliary heat conduction of the solder wire during the welding process, remove oxidation, reduce the surface tension of the material to be welded, remove the oil on the surface of the material to be welded, and increase the welding area. It can be seen that the wettability, corrosion and other important properties of solder wire mainly depend on the quality of flux. [0003] The flux of traditional solder wire usually adopts rosin resin flux composed of rosin, resin, halide-containing activator, additive and organic solvent. Although this type of flux has good solderability and low cost, there are many flux residues, obvious odor and splashing after welding, which pose a threat to the health of users and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/26
CPCB23K35/262B23K35/3613
Inventor 楼倩杨文静汪洋杨永兴
Owner 工业和信息化部电子第五研究所华东分所
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