Thin film encapsulation structure and touch display device

Abstract

The invention provides a thin film packaging structure and a touch display device. The thin film packaging structure is used for packaging a light-emitting device on a display panel, which includes a shielding layer, a first inorganic layer and a second inorganic layer; the shielding layer includes a visible part and a connecting part; the visible part is located between the first inorganic layer and the second inorganic layer, and the connecting part is connected to an external circuit to apply a shielding voltage; The potential plane to which the shielding voltage corresponds. The present invention reduces the parasitic capacitance formed between the electrode layer of the light-emitting device and the touch driving electrode at a lower layer, avoids affecting the sensitivity of the TSP, which causes the TSP to fail to work normally, improves the performance of the TSP, and at the same time, can Shield the harmonic interference generated by the TSP when the light-emitting device is driven.

Description

technical field [0001] The embodiments of the present invention relate to the field of display technology, and in particular to a thin film packaging structure and a touch display device. Background technique [0002] At present, due to the rapid development of touch technology, high-end mobile phones, electronic wristbands, electronic watches and other electronic equipment generally use display devices with touch screen panels (Touch Screen Panel, TSP), that is, touch display devices as human-machine The main input device for interaction, among them, is to use its touch drive and the capacitance change between its sensing electrodes to detect the touch position. [0003] In the production process, light-emitting devices such as OLEDs need to be encapsulated with thin films, and then TSP is installed on the thin film encapsulation structure. Traditional thin film encapsulation structures such as figure 1 as shown, figure 1 For conventional thin film encapsulation structure...

AI Technical Summary

Problems solved by technology

[0004] However, when there is a large potential difference between the electrode layer 20 of the light-emitting device and the touch driving electrodes at a lower layer, a parasitic capacitance will be generated. When the TSP is touched, if the parasitic capacitance is much larger than the touch driving and sensing electrodes It is difficult for the touch chip to detect the relative change of the capacitance between the touch driving and sensing electrodes, and the light-emitting device on the display panel will generate large harmonic interference to the TSP when it is driven, while the traditional The thin-film packaging structure is difficult to reduce the parasitic capacitance formed between the electrode layer 20 of the light-emitting device and the touch driving electrode at a lower layer, thereby affecting the sensitivity of the TSP, and even causing the TSP to fail to work normally, reducing the performance of the TSP, and at the same time cannot Avoid the large harmonic interference to the TSP when the light-emitting device on the display panel is driven

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