Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the direction of optics, optomechanical equipment, printed circuit, etc., can solve problems such as inability to correspond to circuit patterns, decrease in clarity, and poor shape, so as to suppress line peeling and defect, simplify Pattern forming process, effect of preventing loss of definition

Inactive Publication Date: 2014-10-01
TAMURA KK
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in direct-drawing exposure, the exposure is hindered by oxygen molecules, and it is difficult to advance the photopolymerization reaction of the coating film deeply.
Therefore, the deep portion of the coating film is not sufficiently photocured, and the cured coating film is undercut, resulting in a problem that the shape of a solder dam that prevents the flow of solder is deteriorated.
In addition, since the shape of the solder resist dam deteriorates, it cannot correspond to a fine pitch circuit pattern, causing problems such as peeling or chipping of the line, that is, there is a problem of sometimes causing a decrease in definition.

Method used

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  • Photosensitive resin composition
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preparation example Construction

[0059] The preparation method of the above-mentioned photosensitive resin composition of the present invention is not limited to a specific method. For example, after mixing the above-mentioned components in a predetermined ratio, pass through mixing equipment such as a three-roll machine, a ball mill, and a sand mill at room temperature, or The photosensitive resin composition of the present invention is prepared by kneading or mixing with stirring equipment such as a high-speed mixer and a planetary mixer. In addition, pre-kneading or pre-mixing may be performed as necessary before the above-mentioned kneading or mixing.

[0060] Next, the usage method of the photosensitive resin composition of this invention mentioned above is demonstrated. Here, the case where the photosensitive resin composition of the present invention is coated on a circuit board to form a solder resist film will be described as an example.

[0061] For example, on a printed circuit wiring board having...

Embodiment 1～10、 comparative example 1～5

[0066] Mix the components shown in the following Table 1 according to the mixing ratio shown in the following Table 1, and mix and disperse them at room temperature using a three-roll machine to prepare the photosensitive resins used in Examples 1-10 and Comparative Examples 1-5. resin composition. Unless otherwise specified, the compounding quantity of each component shown in following Table 1 represents a mass part.

[0067] Table 1

[0068]

[0069] In addition, the detail of each component in Table 1 is as follows.

[0070] (A) Photosensitive resin containing carboxyl group

[0071] · ZFR-1122: An acid anhydride additive of bisphenol F type epoxy acrylate, manufactured by Nippon Kayaku Co., Ltd.

[0072] (B) Photopolymerization initiator

[0073] (B-1) Oxime ester compound

[0074] OXE-02: ethyl ketone, 1‐[9‐ethyl‐6‐(2‐methylbenzoyl)‐9H‐carbazole‐3‐yl]‐, 1‐(O‐acetyloxime), BASF Made by the company.

[0075] (B-2) Aminocarbonyl compounds having tertiary amino grou...

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Abstract

A photosensitive resin composition includes a carboxyl group-containing photosensitive resin, a photopolymerization initiator, a compound having an ethylenic unsaturated group, a non-reactive diluent, and an epoxy compound. The photopolymerization initiator includes an oxime ester compound and an aminocarbonyl compound having a tertiary amino group.

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for covering materials, such as covering materials for covering conductor circuit patterns formed on substrates such as printed wiring boards, and printed materials coated with cured products obtained by curing the composition. Wiring substrates such as circuit wiring boards. Background technique [0002] For example, when forming a solder resist film (solder resist film) on a printed wiring board, conventionally, a photomask is provided on the coating film of the printed wiring board, and a single exposure to the entire surface of the printed wiring board is used. The exposure method performs an exposure process. However, in recent years, when exposing a photosensitive resin composition coated on a printed wiring board, exposure by a direct drawing device that directly draws an image using CAD data has attracted attention. [0003] Conventional photosensitive resin composit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027H05K1/02
CPCG03F7/038H05K1/0373G03F7/031G03F7/032G03F7/0388H05K3/287H05K3/3452H05K2201/0166Y10T428/24802
Inventor 前川浩二柿内直也竹林敬城堀泽和宽
Owner TAMURA KK
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