57results about How to "Simplify the forming process" patented technology

This invention provides a Cu-Mn alloy sputtering target characterized by comprising 0.05 to 20% by weight of Mn and not more than 500 ppm by weight in total of Be, B, Mg, Al, Si, Ca, Ba, La, and Ce with the balance consisting of Cu and unavoidable impurities. There is also provided a copper alloy wiring for a semiconductor, wherein a self-diffusion suppression function can be imparted to the copper alloy wiring for a semiconductor per se to effectively prevent contamination of a part around the wiring by the diffusion of active Cu. Further, in the copper alloy wiring for a semiconductor, for example, electromigration (EM) resistance and corrosion resistance have been improved, a barrier layer can be arbitrarily and easily formed, and, further, the film forming step of a copper alloy wiring for a semiconductor can be simplified. A sputtering target for the formation of the wiring, and a method for forming a copper alloy wiring for a semiconductor are also provided.

[Object] Provided is a resin panel produced such that the positioning of a reinforcing material can be precisely done, rattling movement is prevented and distortion by molding shrinkage is not caused because the reinforcing materials are maintained in the foam. [Solving Means] A resin panel 1 is a hollow double-wall structure including a front wall 2, a back wall 3 and a peripheral wall 4 joining the front wall 2 and back wall 3 together. The peripheral wall 4 of the resin panel 1 has a welded part 7 on its entire periphery. Within a hollow part 5 is inner packed a foam 8 made of a thermoplastic resin that is formed in advance in the substantially the same shape as the shape of the space within the hollow part 5. The foam 8 is welded on the inner wall faces of the front wall 2 and back wall 3 of the resin panel 1. In the foam 8 are formed accommodation parts 10, 10 for accommodating reinforcing materials 9, 9. The reinforcing materials 9, 9 are lengthwise. The foam 8 intervenes between the ends of both of the reinforcing materials 9, 9 and the peripheral wall 4.

A forming method and forming mold for a semi-closed thin plate part, the forming mold includes a base and an inner tire, the base is provided with a concave cavity matching the shape of the bottom of the part, and the inner tire contains a left inner tire , the right inner tire and the support core, place the bent part on the cavity of the forming mold base, and then fill the left inner tire, right inner tire and support core in the bent part in turn Cavity, use positioning pins to fix and position the forming parts, and finally disassemble the forming mold, remove the process lugs, and correct the external dimensions of the parts.

The invention discloses a method for preparing a fuel cell membrane electrode with a sealing frame. The process is simple and easy to realize. The method comprises the following steps: feeding a polymer electrolyte membrane and a sealing frame material with a layer of hot melt adhesive into a rolling device of a hot pressing platform, jointing the sealing frame material to edges of two sides of the polymer electrolyte membrane through heating rolling, and laminating a gas diffusion layer coated with a catalytic layer on two sides of the polymer electrolyte membrane so as to form a membrane electrode component. In the preparation process, a catalyst liquid is directly coated on the gas diffusion layer instead of the polymer electrolyte membrane, so that damage to a catalytic layer is reduced, the situation that later process is affected by swelling deformation of the membrane in the spraying process is avoided, the formation procedure can be simplified, continuous large-scale production of GDE and MEA can be conveniently achieved, and the production efficiency is greatly improved.

An apparatus for forming a surface shape includes a resist forming device for forming a resist of a predetermined shape on a predetermined surface of the etching object, and an etching device for performing etching to the predetermined surface of the etching object on which the resist is formed. The resist forming device includes a resist discharging device for forming a resist of a predetermined shape by discharging a resist material to the predetermined surface of the etching object. The appararus can form a surface shape of an etching object in a short time at low cost, and to make the surface shape to be formed highly accurate.

The invention provides a flexible die forming method with approximatively equal wall thickness for a variable-diameter part, which relates to a flexible die forming method of a variable-diameter part. The invention is used for solving the problems of wall thickness reduction and uneven distribution of the wall thickness because of one-step forming, which exist in the forming of a traditional variable-diameter part. The method comprises the following main steps of: putting a cylinder blank into a die cavity of a die and putting a mandrel into the cylinder blank; filling a sticky and elastic plastic material; sealing; combining the die; jointing the cylinder blank and the die cavity of the die tightly under the pressure action of the sticky and elastic plastic material inside the cylinder blank and the pressure of the die and forming; sinking the die and taking out the formed variable-diameter part; and removing the mandrel and eliminating the residual sticky and elastic plastic material inside the variable-diameter part. The wall thickness of the variable-diameter part manufactured by the method is even, the forming limit of the variable-diameter part is enhanced, the distribution of the wall thickness of the variable-diameter part is improved, the surface quality of the variable-diameter part is enhanced, and the manufacturing cost of the variable-diameter part is also lowered. The method is used for forming the variable-diameter part.

The invention discloses a fast preparation method of a calcium oxide based ceramic casting mold for manufacturing complex parts, and belongs to the fast precise casting field. The method comprises the following steps: manufacturing a ceramic casting mold biscuit by adopting calcium carbonate powder and moderate mineralizing agent as raw materials, degreasing the biscuit, placing in a vacuum sintering furnace together with moderate metallic calcium to perform the reaction sintering, and then placing the casting mold in an atmosphere sintering furnace to finally sinter. The metallic calcium simple substance is reacted with carbon dioxide produced by decomposing calcium carbonate to produce calcium oxide so as to improve the compactness of the ceramic casting mold. The moderate mineralizing agent is used for promoting the sintering of the ceramic casting mold, and the hydration resistance of the ceramic casting mold is improved. The calcium oxide based integral ceramic casting mold prepared through above method has excellent high-temperature comprehensive performance, solves the technical problem that the aluminum oxide based ceramic casting mold is hard for core removal and high in rejection index, and is especially suitable for the fast manufacturing of complex parts.

The present application discloses a packaging method and packaging structure of an image sensor chip, wherein, in the packaging method of the image sensor chip, during the bonding process of the transparent cover plate and the substrate, the first part of the transparent cover plate is An adhesive film layer completes the photosensitive area and the non-photosensitive area, so that a cavity-free structure is formed between the light-transmitting cover plate and the image sensor chip, ensuring sufficient adhesion between the light-transmitting cover plate and the image sensor chip Therefore, during the subsequent injection molding process of a single image sensor chip and substrate to form a plastic seal layer, due to the strong bonding strength between the light-transmitting cover plate and the image sensor chip, multiple injection moldings are not required The plastic sealing layer can be directly formed at one time, which not only simplifies the forming process of the plastic sealing layer, but also does not need to control the first adhesive film layer only on the periphery of the photosensitive area, which reduces the bonding accuracy of the image sensor chip and the light-transmitting cover plate , thereby reducing the packaging difficulty of the image sensor chip.

The invention discloses a tool head and method for controlling the buckling deformation in a thin plate die-free gradual edge turning process. A long cylindrical body is arranged at the upper end of the tool head. The lower end of the long cylindrical body is connected with a disc. The bottom face of the disc is connected with a big-end-down circular truncated cone. The diameter of the small end of the circular truncated cone is smaller than that of the disc. The large end of the circular truncated end is connected with a large cylindrical body, wherein the diameter of the large end of the circular truncated end is the same as the diameter of the large cylindrical body. The method includes the following steps that an inclined face of the circular truncated cone of the tool head makes contact with the edge of a plate material, and a gap of 2 mm to 3 mm is formed between the bottom face of the disc and the upper surface of the plate material; the tool head horizontally extrudes the edge of the plate material to make the plate material bent upwards till the plate material makes contact with the bottom face of the disc; the tool head moves along the periphery of the plate material so that the same deformation can happen to an edge to be turned; the tool head is lifted, the steps are repeatedly executed, and performing is completed; the edge to be preformed is shaped through the side wall of the large cylindrical body of the tool head, and a vertical turned edge is obtained. The tool head and method have the advantages that deformation of the plate material is controlled through the combination of the tool head and a program, the longitudinal upwarp in the die-free gradual edge turning forming process can be eliminated, and the tool head and method are easy to obtain and implement and feasible.