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A packaging method and a packaging structure of an image sensing chip

An image sensor chip and packaging structure technology, which is applied to radiation control devices, electrical components, electric solid devices, etc. Problems such as high difficulty and complex process can achieve the effect of simplifying the forming process, reducing the bonding accuracy and reducing the difficulty of packaging

Active Publication Date: 2018-12-28
CHINA WAFER LEVEL CSP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, limited by the packaging structure and its forming process, the plastic sealing layer in the prior art needs multiple injection molding processes, which not only complicates the process, but also requires relatively high bonding accuracy between the image sensor chip and the light-transmitting cover plate. High, making the packaging of image sensor chips more difficult

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  • A packaging method and a packaging structure of an image sensing chip
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Embodiment Construction

[0079] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0080] In order to make the above objects, features and advantages of the present application more obvious and comprehensible, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0081] refer to Figure 1-Figure 17 , Figure 1-Figure 17 It is a schematic diagram of the preparation process of the packaging method of the image sensor chip provided in the embodiment of the present applic...

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Abstract

The invention discloses a packaging method and a packaging structure of an image sensing chip. According to the method, in the process of bonding the transparent cover plate and the substrate, the first adhesive film layer of the transparent cover plate is completely photosensitive and non-photosensitive, so that a cavity-free structure is formed between the transparent cover plate and the image sensing chip, the adhesive strength between the transparent cover plate and the image sensing chip is ensured to be sufficient, so as to carry out an injection molding process on a subsequent single image sensing chip and a substrate. In the process of forming the plastic sealing layer, the adhesive strength between the transparent cover plate and the image sensing chip is strong, and the plastic sealing layer can be directly formed at one time without carrying out multiple injection molding processes, which not only simplifies the forming process of the plastic sealing layer, but also eliminates the need to control the first adhesive film layer only at the periphery of the photosensitive region, reduces the bonding accuracy of the image sensing chip and the light-transmitting cover plate,and further reduces the packaging difficulty of the image sensing chip.

Description

technical field [0001] The present application relates to the technical field of optical detection devices, and more specifically, to a packaging method and packaging structure for an image sensor chip. Background technique [0002] An image sensor chip is an electronic device that senses external light and converts it into an electrical signal. Image sensor chips are usually fabricated using semiconductor manufacturing processes. After the image sensor chip is manufactured, a packaged package structure is formed by performing a series of packaging processes on the image sensor chip to be used in electronic devices such as digital cameras and digital video cameras. [0003] When packaging the image sensor chip, it is necessary to first bond the image sensor chip to the light-transmitting cover plate, and then carry out processes such as wire bonding and plastic sealing to realize the packaging of the image sensor chip and improve the quality of the image sensor chip. Excel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14601H01L27/14632H01L27/14683
Inventor 王之奇
Owner CHINA WAFER LEVEL CSP
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