Semiconductor laser unit of single chip optical fiber coupling output

Abstract

The invention relates to the technical field of a laser, in particular to a semiconductor laser unit of a single chip optical fiber coupling output. The semiconductor laser unit comprises a shell, wherein a heat sink is arranged in the shell and is provided with a single tube chip; the semiconductor laser unit further comprises a laser beam shaping system, a flat head optical fiber, a mortice and a sleeve, wherein the laser beam shaping system is located in the shell, the single tube chip is coupled with and aimed at the front end of the flat head optical fiber through the laser beam shaping system, the flat head optical fiber is arranged in the mortice which is sleeved in the sleeve, and the sleeve is fixed on the outside surface of a pipe orifice of the shell. The semiconductor laser unit provided by the invention is simple in structure, light beams which pass through the laser beam shaping system are directly coupled to the flat head optical fiber preloaded into the mortice, and then are fixed on the outer surface of the shell through the sleeve to realize laser output and optical fiber pigtail packaging, so that the packaging difficulty of products can be reduced, and the cost can be reduced; meanwhile, the product reliability and quality can be critically improved.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a single-chip fiber coupled output semiconductor laser used directly in the printing industry and used as a seed source in fiber lasers. Background technique [0002] The application of semiconductor laser technology in industry, national defense, medical treatment, and printing industry is becoming more and more extensive and in-depth. Its high stability, energy saving and environmental protection advantages are prominent, and the quality and service life of semiconductor lasers are also more and more demanding. higher. [0003] Such as figure 1 As shown, the single-chip fiber-coupled semiconductor laser of the prior art includes a heat sink 102 disposed in the housing 101, wherein an optical fiber spacer 104 needs to be placed in front of the single-tube chip (ie, the semiconductor laser chip) 103, Then use adhesive (glue or glass solder) 105 to bond the lens fiber 106 to the ...

AI Technical Summary

Problems solved by technology

[0004] This single-chip fiber-coupled semiconductor laser has a complex structure and has the following disadvantages: 1. The lens fiber needs to be polished, which increases the cost; 2. The lens fiber is fixed on the fiber gasket, which is prone to stress and light leakage. Even the optical fiber is burned; 3. The optical fiber metal tube is packaged with solder, which increases the difficulty and cost of the process

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