A packaging structure of an image sensor and its packaging process

Abstract

The invention discloses a packaging structure of an image sensor. The packaging structure of the image sensor comprises a substrate; the substrate comprises a base part; the rim part of the upper surface of the base part is extended upward to form an enclosed type support part; the upper surface of the base part in the cavity formed by the support part and the base part is fixedly provided with an image sensor chip in an adhesion manner through an adhesion layer; a sealing connection ring, an external welding plate, an interconnection line and an inner welding plate are successively manufactured on the rim of the bottom end of the film glass optical window through optical etching, evaporation or sputtering from the outside to the inside; the upper end surface of the support part is provided with a support part welding plate cooperating with an external welding plate on the side close to the image sensor; the support part upper end surface of the external side of the support part welding plate is provided with a support part sealing connection ring cooperating with the sealing connection ring; a plurality of semicircular through holes are arranged on the circumferential rim of the base part at equal interval, wherein the breaches of the semicircular through holes face outward and the lower end of the semicircular through hole is communicated with the lower end surface of the base part; and the bottom end surface of the base part is provided with a base part external welding plate.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to a packaging structure of an image sensor and a packaging process thereof. Background technique [0002] Existing image sensors usually install the chip in the cavity of the base (such as CLCC ceramic base, PLCC organic base), interconnect the chip and the base with gold wire or aluminum wire, and then use glass plate light window to bond and seal ; Then there is the wafer-level packaging that uses through-silicon via technology (TSV) for vertical conduction. The former has the disadvantages of large height and size, while the latter has shortcomings such as large investment and high packaging cost, which cannot meet the requirements of ultra-thin and ultra-small size. Sensor packaging requirements. [0003] Aiming at the problems in the related technologies, no effective solution has been proposed yet. Contents of the invention [0004] The object of the pre...

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Problems solved by technology

[0002] Existing image sensors usually install the chip in the cavity of the base (such as CLCC ceramic base, PLCC organic base), interconnect the chip and the base with gold wire or aluminum wire, and then use glass plate light window to bond and seal ; Then there is the wafer-level packaging that uses through-silicon via technology (TSV) for vertical conduction. The former has the disadvantages of large height and size, while the latter has shortcomings such as large investment and high packaging cost, which cannot meet the requirements of ultra-thin and ultra-small size. Sensor Packaging Requirements

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