Array spray heat dissipating surface based on three-dimensional curved surface

Abstract

The invention discloses an array spray heat dissipating surface based on a three-dimensional curved surface. The array spray heat dissipating surface comprises a plurality of heat dissipating units which are three-dimensional curved surfaces, and are arranged in an array and spliced into a complete heat dissipating surface. A nozzle is arranged above the heat dissipating surface, and a liquid discharge pipe is arranged under the heat dissipating surface. A liquid discharge port is disposed on a recessed portion of the heat dissipating surface, and is connected with the liquid discharge pipe. The unvaporized liquid on the heat dissipating surface is discharged through the liquid discharge port and the liquid discharge pipe. The array spray heat dissipating surface uses the heat dissipatingunits with three-dimensional curved structures, increases the heat exchange area and improves a heat exchange effect compared with a smooth flat surface, and is simple in surface processing and savescost compared with a microstructured flat plate. The liquid discharge port is arranged on the heat dissipating surface and can inhibit the formation of water on a spray cooled surface, help to reducethe thickness of a liquid film, and improve the heat transfer coefficient of the spray cooled surface. Different sizes of heat dissipating surfaces can be designed according to requirements in order to be suitable for various working environments.

Description

technical field [0001] The invention relates to spray cooling technology, in particular to an array type spray cooling surface based on a three-dimensional curved surface. Background technique [0002] A large amount of heat is generated during the use of electronic products. If this part of the heat cannot be dissipated in time, the temperature of electronic devices will rise sharply, which will greatly reduce the stability and life of electronic products, and even damage them. With the miniaturization and integration of semiconductor electronic products, the local heat flux density of electrical devices is getting higher and higher, and the problem of thermal safety of electronic products has become increasingly prominent. Therefore, it is particularly important to solve the heat dissipation problem of high-power, high-heat-flux electronic equipment. [0003] Many studies have proved that spray cooling has the advantages of higher heat transfer coefficient, lower flow rat...

AI Technical Summary

Problems solved by technology

[0003] Many studies have proved that spray cooling has the advantages of higher heat transfer coefficient, lower flow rate, and uniform cooling, and is an effective way to solve the heat dissipation problem of such electronic equipment, but the existing spray cooling technology has the following disadvantages: (1 ) At present, the spray cooling surface mainly adopts a smooth flat surface or a flat surface with a microstructure. The processing of a smooth flat surface is relatively simple, but the heat transfer area is limited. The microstructure surface can effectively increase the heat transfer area and improve the spray cooling performance, but the processing is more complicated. ; (2) The liquid drainage effect on the surface of the flat plate and the microstructure spray is poor, and it is easy to cause some droplets to not completely evaporate and remain on the surface of the heat source to form a water film, which reduces the heat transfer effect; (3) The larger the area of ​​the plate structure, the easier it is to produce a water film Insufficient heat dissipation and limited heat source area available

Images