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A circuit repair method for high-precision circuit pcb

A high-precision, circuit technology, applied in the direction of printed circuit maintenance/correction, printed circuit, printed circuit manufacturing, etc., can solve the problems of falling off, insufficient pressure, small welding area, etc., to prevent falling off, improve bonding force, improve The effect of reliability

Active Publication Date: 2020-08-11
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The invention provides a circuit repair method for high-precision circuit PCB. The technical problem to be solved is that the existing repairing process of first repairing the wire and then pressing the foot is easy to cause shedding due to the small welding area and insufficient pressure.

Method used

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  • A circuit repair method for high-precision circuit pcb
  • A circuit repair method for high-precision circuit pcb
  • A circuit repair method for high-precision circuit pcb

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Embodiment Construction

[0032] The embodiment of the present invention will be explained in detail below in conjunction with the accompanying drawings. The examples given are only for the purpose of illustration, and cannot be interpreted as limiting the present invention. The accompanying drawings are only for reference and description, and do not constitute the scope of patent protection of the present invention. limitations, since many changes may be made in the invention without departing from the spirit and scope of the invention.

[0033] A kind of circuit repairing method of high-precision circuit PCB provided by the embodiment of the present invention, its workflow is as follows figure 1 shown, including the following steps:

[0034] S1. Increase the contact area between the surface of the PCB to be repaired and the repaired gold wire (before the repair of the circuit, increase the further roughening process of the circuit and increase the roughening level of the circuit surface);

[0035] S...

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Abstract

The invention relates to the technical field of PCB circuit repair, and specifically discloses a circuit repair method for a high-precision circuit PCB. The circuit repair method comprises the following steps: increasing the contact area of the to-be-repaired circuit surface of the PCB and a repair gold wire; welding the repair gold wire to the to-be-repaired circuit surface of the PCB, and synthesizing a wire repair plate; applying pressure to the surface of the repair gold wire of the wire repair plate; extracting by using a first preset sampling proportion to complete AOI scanning for the repair wire plate in the previous step, and detecting whether the repair gold wire falls or not so as to increase the coarsening degree in the first step and / or increase the pressure applied in the third step. The circuit repair method has the obvious advantages that the to-be-repaired circuit surface and the surface of the gold wire are coarsened, so that the welding contact area of the gold wireand the circuit is increased, the resistance at the welding position can be reduced effectively, the electrification heat productivity is reduced, and the reliability of the product when in use is improved; the circuit and the surface of the gold wire are coarsened, the binding force between the gold wire and the circuit is improved, the gold wire is prevented from falling off in the subsequent procedure, and the internal proportion of the product is reduced.

Description

technical field [0001] The invention relates to the technical field of PCB circuit repair, in particular to a circuit repair method for high-precision circuit PCB. Background technique [0002] Usually, the line width and line spacing of high-precision circuit PCB are usually around 3mil (Chinese transliteration: mil, one mil is equal to one-thousandth of an inch, equal to 0.0254mm). It is easy to cause the following problems when wiring: [0003] 1) The width of the line repairing gold wire is too thin, it is easy to fall off during the manual moving process, and it is easy to move, forming an inward opening; [0004] 2) After the line is repaired, it is easy to fall off when passing through the horizontal cleaning line and the pre-treatment of solder mask, causing inward opening; [0005] 3) The gold wire after falling off is easy to overlap with other lines to form an inner short; [0006] 4) It is difficult to find the poorly repaired lines in the follow-up, and conti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22
CPCH05K3/225H05K2203/173
Inventor 王欣曾祥福周刚
Owner GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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