38results about How to "Increased solder contact area" patented technology

The present disclosure is directed to a leadframe package having solder wettable sidewalls that is formed using a pre-molded leadframe and methods of manufacturing the same. A metal plated leadframe with a plurality of recesses and a plurality of apertures is placed into a top and bottom mold tool. A molding compound is then formed in the plurality of recesses and apertures in the leadframe to form a pre-molded leadframe. A plurality of die and wires are coupled to the pre-molded leadframe and the resulting combination is covered in an encapsulant. Alternatively, a bare leadframe can be processed and the metal layer can be applied after encapsulation. A saw or other cutting means is used for singulation to form leadframe packages. Each resulting leadframe package has a solder wettable sidewall for improving the strength of solder joints between the package and a circuit board.

The present invention provides a method of manufacturing a compound liquid titanium steel nozzle whose joint surface has complicated structure, including procedures as following: (1) a surface of steel blank is provided with a transition layer; (2) the steel blank with the transition layer is put into a mold; (3) titanium alloy powder is arranged between the mold and the steel blank and the mold is sealed; (4) not isostatic pressing treatment for the sealed mold is practiced; (5) a blank of compound liquid titanium steel nozzle is taken out and made into the compound liquid titanium steel nozzle. The present invention adopts method of electroplate or ion plating to form a form a transition layer on the steel surface that is made up of Cu, Ni, Cr, Mo, and V, which not only increases contact area for titanium and steel but also forms a mechanical lock, thus, further improving joint strength of two metals mentioned-above. The present invention makes use of powder flowability of TC4 titanium alloy to realize that two metals can fully contact with each other at any complicated joint surface.

The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.

The invention provides an antenna and a wireless signal transceiver system, and relates to the technical field of antennas. The influence of the internal material of an insulating substrate on the radiation efficiency, bandwidth and consistency of an antenna can be reduced. The antenna provided by an embodiment of the invention comprises an insulating substrate which consists of a first surface and a second surface opposite to the first surface. A radiating element layer is formed on the first surface. A hollowed-out area is formed inside the insulating substrate. The inner wall of the hollowed-out area is isolated from the first surface. The radiating element layer is connected with a grounding connector and a feeding connector. The antenna and the wireless signal transceiver system can be used in an indoor coverage system.

The invention provides a temporary frame wire grid type high-temperature strain gauge and a manufacturing and using method thereof, and relates to the technical field of high-temperature strain testing. The temporary frame wire grid type high-temperature strain gauge comprises sensitive wire grid, lead wires, a temporary frame and welding spots. Wire materials are convoluted and wound into the shape of the sensitive wire grid through winding equipment; the sensitive wire grid and the lead wires are fused and tightly connected through resistance welding; and the sensitive wire grid and the leadwires are fixed on the temporary frame through nitrocellulose glue to form the temporary frame wire grid type high-temperature strain gauge. The high-temperature strain gauge is fixed on the surfaceof a tested piece through surface cleaning during using, primer or coating and curing, primary capping or coating and curing, integral capping or coating and curing. According to the temporary frame wire grid type high-temperature strain gauge and the manufacturing method thereof, resistance values are adjustable, the resistance dispersibility is less than +/-1 omega, and requirements of high-temperature strain measurement of room temperature at -1000 DEG C for a long time and 1000-1200 DEG C for a short time can be met.

The invention provides a rotary anode target for an X-ray tube, a preparation method and a target assembly. The anode target comprises a target disc and an annular cover. The target disc comprises a substrate and a target surface layer covering the substrate. A first center hole is formed in the center of the substrate. A second center hole is formed in the center of the target surface layer. Theannular cover covers the inner circumferential side wall of the first center hole and is connected with the substrate, and the annular cover is used for reducing or blocking the diffusion of the heatemitted by the substrate. The rotary anode target can reduce the heat transmitted to a rotating shaft or a bearing in a heat radiation mode, obviously reduces the temperature of a metal ball, and prolongs the service lives of the bearing and the X-ray tube. Moreover, the power continuously loaded by the X-ray tube is higher, and more patients can be scanned in unit time.

The invention discloses a cable and cable connector welding process. The cable and cable connector welding process comprises the following steps of (a) pressing a tin wire to be flat and manufacturing a flat tin wire; (b) winding the flat tin wire on the contact position of a cable and a cable connector; (c) inserting the contact position of the cable and the cable connector into the cable connector; (d) wrapping a circle of non-pressed tin wire on the cable and enabling the non-pressed tin wire to tightly abut against the outer end of a casing of the cable connector; (e) heating the casing of the cable connector and finishing welding. The cable and cable connector welding process can enable the welding position to be evenly welded and accordingly improve the stability in a dynamic state. In addition, the welding time can be shortened, heat is prevented from influencing the matching size, and accordingly the electrical performance of the cable is improved.

The invention discloses an electrolytic bath cathode steel bar and soft aluminum strip connection configuration structure, which is characterized in that: cathode steel bars (1) and a soft aluminum strip (5) are connected through connecting plates (2), a steel-aluminum explosive welding block (3) and backing plates (4). Specifically, the cathode steel bars (1) and the connecting plates (2), and the steel-aluminum explosive welding block (3) and the soft aluminum strip (5) are connected by means of welding. The backing plates (4) are located below the connecting plates (2) and the steel-aluminum explosive welding block (3). The connecting plates (2), the steel-aluminum explosive welding block (3) and the backing plates (4) are connected by welding. The connecting plates (2) are rectangular or ''L'' shaped. By means of non-rectangular treatment on the connecting plates, the connecting plates are welded with the end faces and the sides of the cathode steel bars, the welding seam is increased, and the welding contact area is enlarged, thus reaching the purpose of lowering the electrolytic bath cathode drop. And the backing plates below the cathode steel bars and the steel-aluminum explosive welding block play a role of supporting the construction process.

The invention provides a vehicle-mounted loop antenna apparatus and a manufacturing method thereof. The apparatus comprises an antenna oscillator, an antenna base and a high frequency connector, wherein the antenna oscillator and the high frequency connector are installed on the antenna base; the antenna oscillator comprises a metal ring, a short welding foot and a long welding foot; the high frequency connector comprises a high frequency connector socket welding needle, a high frequency connector flange plate and the like; and the short welding foot of the antenna oscillator and the high frequency connector socket welding needle are overlapped, are wound firmly through a bare copper wire and then are welded. The vehicle-mounted loop antenna apparatus is characterized by further comprising a plurality of welding sheets. One end of each welding sheet is fixed to the high frequency connector flange plate; the non-fixed end of each welding sheet is bent by an angle of 90 degrees towards the direction of the antenna oscillator; the distances between the bending parts of the welding sheets are the diameter of a antenna oscillator material; and the long welding foot of the antenna oscillator is inserted to the vertically bent butt joint position of the rail ends of the welding sheets and is firmly connected with the high frequency connector flange plate in a welding mode. The apparatus and the method provided by the invention solve the problems of easy unsoldering, antenna swinging and the like caused by unfavorable environments of vibration and impact of an external environment and the like during a use process of a conventional vehicle-mounted antenna.

The invention discloses a manufacturing method of a surface mounting capacitor for enhancing weldability; laminated metal films are clamped together by adopting a special tooling, metal is sprayed on the side end surface of the laminated metal films, so as to lead the upper and lower ends of a metal spraying layer formed by spraying the metal on the side end surface of the laminated metal films to be respectively provided with an upward bulge and a downward bulge which is symmetrical with the upward bulge along the horizontal direction; a sunk part is arranged on the special tooling, the sunk depth of the sunk part is 0.07-0.13mm, the inner end of the sunk part is an inclined surface, the inclined surface and the sunk surface of the sunk part and the normal surface of the tooling are connected smoothly, the inclined surface of the sunk part and the normal surface of the tooling form an included angle with 30-50 degrees; by adopting the special tooling, the upper and lower end surfaces of the metal spraying layer at two ends of the laminated metal films are bulged, the welding contact area is increased, the welding reliability is ensured, and the probability of insufficient welding and tomb stone and the like of the surface mounting capacitor is greatly reduced.

The invention discloses a capacitor and a preparation method and an installation method of the capacitor, the capacitor comprises a capacitor body, a first pin and a second pin extend out of the right side end face of the capacitor body, the first pin and the second pin respectively comprise a protection pin, a heat dissipation pin and a welding pin which are the same, the length of the heat dissipation pin is larger than the radius of the capacitor body, and the length of the welding pin is larger than the radius of the capacitor body. The surface of the upper end of each welding pin is provided with a plurality of uniformly distributed through holes, each through hole is in a quadrangular frustum pyramid shape, the four side faces of each quadrangular frustum pyramid obliquely extend upwards by 30 degrees to form a circular hole channel, and the through holes and the circular hole channels are filled with soldering tin. The whole capacitor is good in heat dissipation effect, space-saving, tighter in welding, material-saving, and capable of reducing occupational diseases of workers. Potential safety hazards are reduced.

The invention provides a heat insulating structure of a pipeline in order to solve the problems that an existing heat insulating structure of the pipeline is complicated in procedure and high in assembly cost. The heat insulating structure of the pipeline comprises a foundation pipe, and an inner protection layer, a connection layer and an outer protection layer are sequentially arranged along thewall of the foundation pipe from inside to outside. The connection layer is two or more metal straps arranged in parallel, one sides of the metal straps are connected with the outer protection layerin a welded mode, and the other sides of the metal straps are in nailed or riveted connection with the inner protection layer. The outer protection layer is evenly provided with concave-convex parts,that is, pits are formed in one side of the outer protection layer, protrusions corresponding to the pits are arranged on the other side of the outer protection layer, and joints of the two ends of the outer protection layer are connected in a welded mode. By means of the heat insulating structure of the pipeline, the step of manually wrapping the pipeline with the inner protection layer is omitted, time is shortened, the assembly efficiency is improved, the assembly cost is reduced, and meanwhile the product quality is ensured.

The invention discloses a straight slot PCD drill bit with cooling holes. The straight slot PCD drill bit is used for drilling of semiconductor wafers. The straight slot PCD drill bit includes a drillshank and a drill rod formed by a combination of an extension rod and a drill point made of a PCB composite material, the drill shank is provided with at least one cooling holes, wherein cooling water can be introduced into the cooling holes, outlets of the cooling holes face the drill rod so that the cooling water flowing from the outlets of the cooling holes can cool the drill rod, the drill rod is provided with a straight groove for chip removal, and an apex angle is formed at the end of the drill point. The drill bit uses the straight groove instead of a spiral chip removal groove in a traditional PCD drill bit, fine cuttings generated during the grinding of the semiconductor wafers by the drill bit can be smoothly discharged out of the holes through the straight groove, so that the blockage due to sticking of the cuttings to the inner part of the groove is avoided. Meanwhile, by forming the cooling holes in the drill shank, the cooling water can be introduced into the cooling holes, the cooling water can be sprayed out from the outlets of the cooling holes toward the drill rod, so that the drill rod is cooled and prevented from overheating, frequent extraction for cooling isavoided, the drilling operation efficiency is improved, and the processing cycle is reduced.