Multi-layer power module

Abstract

The invention provides a multi-layer power module which comprises a first power electrode, a second power electrode, an output electrode, a first insulating base plate, a second insulating base plate,a third insulating base plate, a first bridge arm power chip, a first bridge arm first conductive layer, a first bridge arm second conductive layer, a second bridge arm power chip, a second bridge arm second conductive layer and a second bridge arm first conductive layer, wherein the first insulating base plate, the second insulating base plate and the third insulating base plate are laminated; the first bridge arm power chip is arranged between the first insulating base plate and the second insulating base plate; the first bridge arm first conductive layer is electrically connected with thefirst power electrode; the first bridge arm second conductive layer is electrically connected with the output electrode; the second bridge arm power chip is arranged between the second insulating baseplate and the third insulating base plate; the second bridge arm second conductive layer is electrically connected with the second power electrode; the second bridge arm first conductive layer is electrically connected with the output electrode; the first bridge arm power chip is electrically connected between the first bridge arm first conductive layer and the first bridge arm second conductivelayer; and the second bridge arm power chip is electrically connected between the second bridge arm second conductive layer and the second bridge arm first conductive layer. Compared with the prior art, the multi-layer power module has lower parasitic inductance.

Description

technical field [0001] The invention relates to the field of power electronics, in particular to a multilayer power module. Background technique [0002] The power module is a power switch module packaged by power electronic power devices such as metal oxide semiconductor (power MOS tube), insulated gate field effect transistor (IGBT), and fast recovery diode (FRD) according to certain functions. It is mainly used for Power conversion in various occasions such as electric vehicles, wind power generation, and industrial frequency conversion. [0003] The motor drive circuit of an electric vehicle usually includes three sets of power modules with upper and lower bridge arms, figure 1 It is a schematic circuit diagram of an existing power module, which shows a schematic circuit diagram of a group of power modules with upper and lower bridge arms, which includes: an insulated gate field effect transistor Z1 as the upper bridge arm, and its reverse The fast recovery diode D1 co...

AI Technical Summary

Problems solved by technology

The parasitic inductance inside the module will cause overvoltage during the turn-off process, and the parasitic parameters will cause waveform oscillation during the switching process of the power module, thereby increasing electromagnetic interference and switching loss

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