Multi-stress comprehensive satellite electronic product service life prediction method

An electronic product, multi-stress technology, used in electrical digital data processing, special data processing applications, instruments, etc., can solve the problem of insufficient life reliability simulation and test verification work, multi-stress comprehensive conditions cannot be implemented, and it is difficult to cover products. On-orbit working conditions and other issues, to achieve the effect of improving the efficiency of life prediction, enhancing engineering practicability, and saving time and costs

Active Publication Date: 2019-04-12
CHINA AEROSPACE STANDARDIZATION INST
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Problems solved by technology

[0004] In view of this, the purpose of the present invention is to overcome the technical defects that the test conditions are difficult to cover the on-orbit working conditions of the product, the weak links cannot be exposed, and the multi-stress comprehensive condi

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  • Multi-stress comprehensive satellite electronic product service life prediction method
  • Multi-stress comprehensive satellite electronic product service life prediction method
  • Multi-stress comprehensive satellite electronic product service life prediction method

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Embodiment Construction

[0019] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0020] The satellite electronic product life prediction method under a kind of multi-stress synthesis of the present invention, such as figure 1 shown, including the following steps:

[0021] Step 1. According to the design structural parameters of satellite electronic products and various environmental and load conditions of satellite electronic products during launch and on-orbit, the types and magnitudes of vibration, thermal stress and electrical stress parameters of satellite electronic products are obtained.

[0022] (1) Vibration environment

[0023] The vibration environment of satellite electronic products during launch mainly includes random vibration and shock. For the PCB board fixed on the chassis, the random vibration energy generated by the emission first excites the chassis structure, and then transmits to the PCB board through the fixed ...

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Abstract

The invention discloses a multi-stress comprehensive satellite electronic product service life prediction method. The force thermoelectric comprehensive use environment of the satellite electronic product is fully considered; accumulating and competition relationships between fault modes and fault mechanisms; single-stress simulation analysis and multi-stress cumulative damage analysis are carriedout; the life prediction of the satellite electronic product is completed by combining a theoretical model and a simulation analysis result; compared with the prior art, the method has very high engineering practicability, so that the service life prediction work in the past is limited under certain engineering development conditions such as insufficient sample size and test data, the service life prediction of the product can be carried out, and the efficiency of service life prediction of the satellite electronic product can be greatly improved; time and cost for service life evaluation ofsatellite electronic products can be effectively saved, service life prediction efficiency is greatly improved, and economic benefits are high. Important reference is provided for service life and reliability evaluation of satellite electronic products, and the method can be popularized and applied to service life prediction and analysis work of electronic products in other fields.

Description

technical field [0001] The invention belongs to the technical field of life prediction of satellite electronic products, and in particular relates to a life prediction method of satellite electronic products under multi-stress synthesis. Background technique [0002] At present, with the increase in the proportion of satellite payloads, the functions of on-board products are becoming more and more complex, and the degree of integration is getting higher and higher. At the same time, products are usually subjected to stress fields such as vibration, heat, and electricity during launch and on-orbit, which have a great impact on product life. Onboard products have the characteristics of wide distribution, high functional integration, and harsh operating environments. Their lifespan and reliability have always been the focus of aerospace models. [0003] The current research shows that the life reliability simulation and test verification of the product have not been fully carr...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/23G06F2119/08G06F2119/06Y02T90/00
Inventor 朱兴高栾家辉代永德韩慧超
Owner CHINA AEROSPACE STANDARDIZATION INST
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