A fully automatic pneumatic packaging table

A fully automatic packaging platform technology, applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as low work efficiency and difficult temperature control, and achieve uniform heating, avoid misalignment, and uniform force Effect

Active Publication Date: 2021-01-15
WUHAN PUDI VACUUM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the shortcomings of low working efficiency and difficult control of working pressure and temperature in the prior art, and propose a fully automatic pneumatic packaging table

Method used

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  • A fully automatic pneumatic packaging table
  • A fully automatic pneumatic packaging table
  • A fully automatic pneumatic packaging table

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0021] refer to Figure 1-3 , a fully automatic pneumatic packaging platform, comprising a base 10, the bottom of the base 10 is provided with a number of legs 101, the legs 101 are fixedly connected to the base 10, the number of the legs 101 is four and are respectively located at the four corners of the base 10, the legs 101 Bottoms are provided with buffer pads, which can play a buffering role during work, thereby protecting the legs 101, one side of the top of the base 10 is provided with a side plate 4, the bottom of the side plate 4 is fixedly connected with the base 10, and the side plate 4 The side is provided with reinforcing ribs, so that the side plate 4 i...

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Abstract

The invention relates to the technical field of packaging and in particular to a fully automatic pneumatic packaging table comprising a base, wherein the bottom of the base is provided with legs; a side plate is arranged on the top of the base; a first support plate and a second support plate are arranged on the side plate; a dual-rod cylinder is arranged between the first support plate and the second support plate and is provided with a high-precision fine adjustment air pressure valve; the high-precision fine adjustment air pressure valve is provided with a first adjustment nut and a secondadjustment nut; the output end of the dual-rod cylinder is provided with a first telescopic rod; one end of the first telescopic rod is provided with a square pressing head; one side of the first telescopic rod is provided with a second telescopic rod; a working box is arranged below the square pressing head; the top of the working box is provided with a square concave table; the bottom of the square concave table is provided with a heating piece; the heating piece is provided with a temperature sensor; the bottom of the heating piece is provided with a spherical platform; and the bottom of the spherical platform is provided with a plurality of mounting columns. The fully automatic pneumatic packaging table realizes temperature and pressure automation, and greatly improves the working efficiency.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a fully automatic pneumatic packaging platform. Background technique [0002] The packaging machine is a kind of smart card production equipment. It sticks the module firmly in the slot on the ISO standard card after a certain period of time and pressure heat welding with hot melt adhesive. Generally speaking, the packaging machine is composed of several parts, namely the feeding group, the rack group, The pre-soldering group and module good or bad identification group, the feeding group is to put the card into the cassette, and the card is pulled down to the delivery arm by the vacuum suction cup by the card cylinder, and the material rack group is to put the chip hot-melt tape into the corresponding After being put on the material rack, the chip hot melt adhesive is introduced into the glue punching paper mold, pre-welding group, chip punching group, etc. through the guide ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L21/67H01L21/68
CPCH01L21/56H01L21/67103H01L21/67253H01L21/68
Inventor 周焱文
Owner WUHAN PUDI VACUUM TECH CO LTD
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