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Display panel, manufacturing method thereof, and display device

A display panel and display area technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem of easy peeling of the packaging layer, reduce the possibility, ensure the reliability of the packaging, and reduce the risk of direct contact area effect

Active Publication Date: 2021-06-04
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device to solve the problem that the encapsulation layer in the display panel is easily peeled off in the prior art

Method used

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  • Display panel, manufacturing method thereof, and display device
  • Display panel, manufacturing method thereof, and display device
  • Display panel, manufacturing method thereof, and display device

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Embodiment Construction

[0031] In order to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0034] It should be understood that the term "an...

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Abstract

Embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device, which relate to the field of display technology and are used to solve the problem that the encapsulation layer in the display panel is easily peeled off in the prior art. The display panel includes a display area and a non-display area surrounding the display area. The display area includes a plurality of light-emitting units, each light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode that are stacked, and the non-display area includes metal electrodes in contact with each other. and an inorganic layer, wherein the metal layer is electrically connected to the second electrode located in the display area, and the metal layer includes an opening filled with an organic layer, and the organic layer is in contact with the metal layer and the inorganic layer respectively.

Description

【Technical field】 [0001] The present invention relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device. 【Background technique】 [0002] Organic Light-Emitting Diode (OLED) display panels are widely used in the field of display technology due to their many advantages such as active light emission, high contrast, no viewing angle limitation, and flexible display. [0003] At present, in order to improve the water and oxygen resistance characteristics of each OLED device in a flexible OLED display panel, a thin film encapsulation (Thin Film Encapsulation, hereinafter referred to as TFE) method is usually used, that is, the encapsulation layer is set as an inorganic layer and an organic layer stacked. To package the OLED display panel. However, in the design of the existing OLED display panel, the inorganic layer in the encapsulation layer is in contact with some metal wiring layers used for signal trans...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L21/762
CPCH01L21/762H10K59/126H10K59/1213H10K59/122H10K59/131
Inventor 饶元元张国峰郭林山
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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