Fluorescent sheet heat dissipation integrated packaging method for LED light source

Abstract

The invention discloses a fluorescent sheet heat dissipation integrated packaging method for an LED light source, and belongs to the technical field of LED light sources, and the method comprises the following steps: S1, placing a blue light chipset on a substrate, and achieving the electrical connection; s2, processing the solid phosphor into a sheet material, a block material or a bar material with a required size; s3, placing the solid-state fluorescent sheet prepared in S2 on a metal heat dissipation support, and placing a high-purity metal ring or a high-purity metal gasket between the solid-state fluorescent sheet and the heat dissipation support to prepare a semi-finished product for later use; and S4, clamping and pressurizing the semi-finished product assembled in the S3, and sintering to obtain the fluorescent heat dissipation integrated metal bracket. S5, the fluorescent heat dissipation integrated metal support prepared in the step S4 is placed on the blue light chip set in the step S1, so that the fluorescent heat dissipation integrated metal support is connected with an external heat sink; according to the invention, the problem that the advantage of high thermal conductivity of the fluorescent ceramic is difficult to play because the fluorescent ceramic packaging mode in the existing LED device mainly adopts transparent silica gel, solder paste and the like for fixed sealing is effectively solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of LED light source fluorescent sheets, in particular to an integrated packaging method for heat dissipation of fluorescent sheets for LED light sources. Background technique [0002] At present, heat dissipation is the key technical bottleneck of high-power and high-lumen-density fluorescent conversion white LED light sources, and the packaging materials, interconnect materials and interconnect void ratios in the light source module are the key factors affecting the heat dissipation performance of the light source module. The interlayer thermal resistance accounts for about 30% of the total thermal resistance of the LED device; at the same time, in the high-power LED light source, due to factors such as the Stokes effect, the heat of the phosphor layer accounts for about 10%-20% of the total heat, which may even affect the working temperature of the LED device. Dominant; fluorescent cera...

AI Technical Summary

Problems solved by technology

[0003] In view of the problem that the fluorescent ceramic packaging method in the above-mentioned LED device is mainly fixed and sealed by using transparent silica gel, solder paste, etc., and it is difficult to take advantage of the high thermal conductivity of fluorescent ceramics, the purpose of the present invention is to provide a good heat dissipation effect, low cost, Encapsulation method of ultra-high power LED light source capable of mass production