Method for manufacturing circuit board

Abstract

The present invention provides a method for manufacturing a circuit board. The method comprises the following steps of: providing an insulation substrate, and arranging at least one through hole penetrating the two opposite surfaces of the insulation substrate on the insulation substrate; forming silver layers respectively on the two opposite surfaces, and forming a silver conductive structure connected with the two silver layers in the through hole; performing copper plating for the insulation substrate with the silver layers and the silver conductive structure to form a copper circuit layer,wherein the copper circuit layer covers the silver conductive structure and the part area of the silver layers; and etching the silver layers by employing first etching liquid to silver circuit layers corresponding to the copper circuit layer, wherein the first etching liquid does not corrode the copper circuit layer.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board. Background technique [0002] At present, many circuit boards will have high complexity, high precision, and high density wiring requirements. In the prior art, the subtractive method or the semi-additive method is usually used to manufacture the circuit when the circuit of the circuit board is manufactured. However, when the currently used subtractive or semi-additive methods etch the copper layer to form lines, due to the occurrence of lateral etching, it is often necessary to increase the line compensation to avoid the reduction of the line width at the top of the line, thereby increasing the difficulty of the process. Contents of the invention [0003] In view of this, it is necessary to provide a method for manufacturing a circuit board with the above problems. [0004] A method for manufacturing a circuit board, comprising the steps of: [0005] providing an insulating subs...

AI Technical Summary

Problems solved by technology

However, when the currently used subtractive or semi-additive methods etch the copper layer to form lines, due to the occurrence of lateral etching, it is often necessary to increase the line compensation to avoid the reduction of the line width at the top of the line, thus increasing the difficulty of the process.

Images