How to make a circuit board

Abstract

A method for manufacturing a circuit board, comprising the following steps: providing an insulating substrate, and opening at least one through hole penetrating through two opposite surfaces of the insulating substrate on the insulating substrate; silver layer, and form a silver conductive structure connecting the two silver layers in the through hole; carry out copper plating to the insulating substrate with the silver layer and the silver conductive structure to form a copper circuit layer, the copper The circuit layer covers the silver conductive structure and part of the silver layer; and the silver layer is etched into a silver circuit layer corresponding to the copper circuit layer by the first etchant, and the first etchant does not corrode The copper wiring layer.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board. Background technique [0002] At present, many circuit boards will have high complexity, high precision, and high density wiring requirements. In the prior art, the subtractive method or the semi-additive method is usually used to manufacture the circuit when the circuit of the circuit board is manufactured. However, when the currently used subtractive or semi-additive methods etch the copper layer to form lines, due to the occurrence of lateral etching, it is often necessary to increase the line compensation to avoid the reduction of the line width at the top of the line, thereby increasing the difficulty of the process. Contents of the invention [0003] In view of this, it is necessary to provide a method for manufacturing a circuit board with the above problems. [0004] A method for manufacturing a circuit board, comprising the steps of: [0005] providing an insulating subs...

AI Technical Summary

Problems solved by technology

However, when the currently used subtractive or semi-additive methods etch the copper layer to form lines, due to the occurrence of lateral etching, it is often necessary to increase the line compensation to avoid the reduction of the line width at the top of the line, thus increasing the difficulty of the process.

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