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A kind of preparation method of ultra-thin graphene thermally conductive adhesive layer

A thermally conductive adhesive layer, graphene technology, applied in the direction of adhesives, pressure-sensitive films/sheets, non-polymer adhesive additives, etc. Poor weather resistance and other problems, to meet the needs of poor thermal conductivity and assembly, good adhesion and thermal conductivity, and ultra-thin physical properties

Active Publication Date: 2020-12-18
DEYANG CARBONENE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, in view of the poor heat conduction effect of the composite adhesive layer, the existing patent document CN107446528A (a heat conduction adhesive and its preparation method, 2017.12.08) discloses a material made of the following weight percentage: acrylic glue 65 ~80%, modified aluminum nitride 10~25%, graphene oxide 0.05~5%, tackifying resin 0.5~3%, dispersant 0.5~2%, the thermal conductivity can reach up to 7.5W / (m.k) thermal paste
This patent uses graphene oxide and modified aluminum nitride as thermally conductive fillers, which has the following problems: graphene oxide has not been reduced, so its thermal conductivity is poor; secondly, aluminum nitride and graphene oxide are premixed first, Graphene is distributed between aluminum nitride and aluminum nitride in a disordered form, and the graphene is not oriented, so the plane thermal conductivity is poor. The thermal conductivity in the final patent does not mention whether it is vertical or horizontal. Thermal Conductivity
The patent uses alumina and graphite as conductive fillers, and the thermal conductivity is relatively low at 1.5W / (m.k). Secondly, the sputtering coating process is more complicated; the use of antistatic agents has poor weather resistance and increases over time. , the antistatic agent will gradually age
And there is no requirement for the size of graphite in the patent, but there is a 50~100 mesh screen filter in the process, so if 200 mesh graphite is used, it is difficult to stay on the PET film

Method used

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  • A kind of preparation method of ultra-thin graphene thermally conductive adhesive layer
  • A kind of preparation method of ultra-thin graphene thermally conductive adhesive layer
  • A kind of preparation method of ultra-thin graphene thermally conductive adhesive layer

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Embodiment 1

[0027] This embodiment proposes a method for preparing an ultra-thin graphene thermally conductive adhesive layer.

[0028] Prepared by the following steps:

[0029] (1) Pretreatment: mechanical stripping or intercalation

[0030] (2) The graphene prepared by the method is used as the raw material, and the graphene satisfies: the carbon-to-oxygen ratio is 50, the number of layers is 8 layers, and the electrical conductivity is 550S / cm. According to the mass percentage, 3% graphene, 96.5% water and 0.5% The mixture of sodium lauryl sulfate and hexadecyl ammonium bromide is prepared into a graphene slurry, stirred by a stirrer for 10 hours, pre-emulsified for 10 hours, emulsified for 200 hours, and dried to obtain a sheet diameter of 460um graphene powder.

[0031] (2) Glue preparation:

[0032] In terms of parts by mass, 5 parts of the graphene powder and 59 parts of toluene prepared in step (1) were taken for ultrasonication or shearing to obtain a graphene / organic solvent ...

Embodiment 2

[0036] This embodiment proposes a method for preparing an ultra-thin graphene thermally conductive adhesive layer.

[0037] Prepared by the following steps:

[0038] (1) Pretreatment: Graphene prepared by mechanical exfoliation method is used as raw material. Graphene meets: carbon-to-oxygen ratio 45, number of layers 10, electrical conductivity 510S / cm, by mass percentage, 3% graphene, 96.5% After preparing the graphene slurry with water and 0.5% sodium dodecylbenzenesulfonate, it was stirred by a stirrer for 0.5h, pre-emulsified for 10h, emulsified for 1h, and dried to obtain graphite with a sheet diameter of 400nm. ene powder.

[0039] (2) Glue preparation:

[0040] In terms of parts by mass, 1 part of the graphene powder prepared in step (1) and 25 parts of ethyl acetate were subjected to ultrasonication to obtain a graphene / organic solvent dispersion.

[0041] In terms of parts by mass, 30 parts of graphene / organic solvent dispersion prepared by the above method and 40...

Embodiment 3

[0044] This embodiment proposes a method for preparing an ultra-thin graphene thermally conductive adhesive layer.

[0045] Prepared by the following steps:

[0046] (1) Pretreatment: Graphene prepared by mechanical exfoliation or intercalation method is used as raw material. Graphene satisfies: carbon-to-oxygen ratio 42, layer number 1 layer, conductivity 505S / cm, and 3% graphite by mass percentage Graphene, 96.5% water and 0.5% hexadecyl ammonium bromide are formulated into graphene slurry, stirred by a mixer for 5 hours, pre-emulsified for 3.5 hours, emulsified for 20 hours, and dried to obtain the size of the sheet. 300nm graphene powder.

[0047] (2) Glue preparation:

[0048] In parts by mass, 2 parts of the graphene powder prepared in step (1) and 35 parts of the mixture of ethyl acetate and xylene were subjected to ultrasonication or shearing to obtain a graphene / organic solvent dispersion.

[0049] In terms of parts by mass, 45 parts of graphene / organic solvent dis...

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Abstract

The invention discloses a method for preparing an ultra-thin graphene thermal-conductive adhesive layer. The method comprises the following steps: using graphene as a raw material for pretreatment inwater and a dispersant to obtain graphene powder; adding an organic solvent into the graphene powder, adding an acrylic pressure-sensitive adhesive after dispersion, premixing and grinding to obtain agraphene composite adhesive; and coating the graphene composite adhesive to obtain the graphene thermal-conductive adhesive layer having a dry film thickness of 1-3 [mu]m. According to the method provided by the invention, the graphene composite adhesive is prepared from the pretreated graphene powder, a two-dimensional structure of graphene can be effectively maintained, folding and ball formingare avoided, the method is suitable for preparation of the ultra-thin graphene thermal-conductive adhesive layer, and the ultra-thin graphene thermal-conductive adhesive layer has good thermal conductivity.

Description

technical field [0001] The invention relates to a method for preparing an ultra-thin graphene thermally conductive adhesive layer, in particular to a method for preparing an ultrathin composite thermally conductive adhesive layer using small-sized graphene as a thermally conductive filler, and belongs to the technical field of graphene materials. Background technique [0002] With the rapid development of electronic consumer products, electronic consumer products such as smartphones, IPADs, and notebooks are gradually developing in the direction of thinner and portable. The electronic product industry stipulates that the adhesive force of the tape used to bond electronic components should be greater than 400gf / 25mm. However, the thicker the composite adhesive layer is, the harder it is for heat to be quickly exported from the heat source to the graphite sheet and the casing. At present, the ordinary composite tapes sold on the market are relatively thick, and there are defec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/00C09J11/04C09J7/38
CPCC09J11/04C09J133/00C09J2433/00C09J7/38C08K9/04C08K3/042
Inventor 姚林徐勇
Owner DEYANG CARBONENE TECH
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