Deposition device and atomic layer deposition equipment

A deposition device and deposition body technology, applied in coating, metal material coating process, gaseous chemical plating, etc., can solve the problems of cross-contamination, incomplete coating of ALD deposition particles, etc., and achieve the effect of solving cross-contamination

Pending Publication Date: 2019-04-26
SHENZHEN YUANSU OPTOELECTRONICS TECH CO LTD
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Problems solved by technology

The atomic layer deposition equipment can uniformly diffuse the reaction gas to the sample well, and can effectively solve the problem of incomplete coating of ALD deposited particles in the prior art; the atomic layer deposition equipment can also be used according to the deposited material Change the corresponding deposition device to avoid cross-contamination when depositing different thin film materials

Method used

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  • Deposition device and atomic layer deposition equipment
  • Deposition device and atomic layer deposition equipment
  • Deposition device and atomic layer deposition equipment

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts all fall within the protection scope of the present invention.

[0028] figure 1 As an embodiment of the present invention, this embodiment provides a deposition device, the deposition device includes:

[0029] A reaction unit, comprising a shell 1 with a hollow structure, the hollow structure forms a reaction chamber 11 for depositing the object to be deposited;

[0030] The supply unit 2 communicates with the reaction chamber 11, and the supply unit 2 includes a reactant delivery module 21;

[0031] Wherein, the reactant...

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Abstract

The invention provides a deposition device. In the deposition device, a hollow shell is used as a reaction cavity. The deposition device comprises a supply unit communicating with the reaction cavity,wherein the supply unit comprises a reactant conveying module which is detachably connected to a reaction unit. Atomic layer deposition equipment comprises a rack and the deposition device and can beused for preparing powder surface coating layers. The atomic layer deposition equipment can effectively solve the problems of cross contamination and incomplete ALD (atomic layer deposition) particlecoating layers occurring when different thin film materials are deposited.

Description

technical field [0001] The invention relates to the field of thin film deposition, in particular to a deposition device and atomic layer deposition equipment. Background technique [0002] Particle surface functionalization is an important part of material surface engineering technology, and it is of great significance to improve the original performance of particles. For example, nano-silver particles have good thermal conductivity, electrical conductivity, and surface plasmon resonance effect. Wrapping nano-silver particles in carbon nanotubes (CNTs@Ag) can enhance the photoelectric performance of matrix carbon nanotubes; in the catalyst The surface of the particles is coated with a protective layer, which can effectively prevent the metal catalysts from agglomerating during the sintering process, resulting in a decrease in catalytic performance or even loss of catalytic performance. [0003] Common methods for particle surface functionalization include sol-gel method (So...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/455
CPCC23C16/45525C23C16/4417
Inventor 李哲峰郑文岸
Owner SHENZHEN YUANSU OPTOELECTRONICS TECH CO LTD
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