Novel computer mainframe box

A main box and computer technology, applied in the computer field, can solve the problems of affecting heat dissipation effect, troublesome dust cleaning, poor heat dissipation effect, etc., and achieve good heat dissipation effect, avoid inconvenient cleaning, and ingenious structure

Active Publication Date: 2019-04-26
盐城市金海洋机电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a new computer main box, which effectively solves the problem of poor heat dissipation and waste of a large amount of electric resources in the existing computer main box; when the main box is used for a long time, the main box It is very troublesome to clean the dust inside, which affects the heat dissipation effect; the speed of the cooling fan is constant, that is, no matter whether the temperature inside the main chassis is low or high, the speed of the cooling fan is constant, and when the temperature in the main chassis is not high, it will Waste of power resources, and when the temperature inside the main chassis is high, the heat dissipation effect is not good

Method used

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Comparison scheme
Effect test

Embodiment 1

[0042] Embodiment 1, the present invention is a kind of novel computer main frame, please refer to figure 1 and figure 2 , including the main chassis 1, the main chassis 1 is externally closed, which is different from the heat dissipation holes provided by the traditional main chassis. The main chassis will not have external dust entering, which then affects the heat dissipation of the parts inside the main chassis 1, so One side of the main chassis 1 is fixedly installed with a heat dissipation box 2 which is hollow inside, and the heat dissipation box 2 is used for cooling the main chassis 1. Please refer to figure 1 and figure 2 , the front and rear ends of the cooling box 2 are equipped with a cooling fan 3, the cooling fan 3 transfers the heat inside the cooling box 2 to the outside, and the cooling fan 3 is driven by the switch control of the main box 1, that is, the main box 1 is turned on When the cooling fan 3 is turned on synchronously to dissipate heat, when the...

Embodiment 2

[0047] Embodiment 2, on the basis of Embodiment 1, in order to realize the adjustment of the flow rate, when the temperature of the device rises, the flow rate of the condensing agent inside the cooling pipe 4 increases to accelerate heat dissipation; please refer to Image 6 The flow rate adjusting device 10 also includes a first bevel gear 21 coaxially fixedly connected to the lower end of the impeller 11, the first bevel gear 21 meshes with a second bevel gear 22, and the second bevel gear 22 is coaxially connected with a second bevel gear a pulley 23, see Figure 10 , the first pulley 23 is connected with a speed regulating device 25 through a belt 24, and the speed regulating device 25 includes a continuously variable transmission wheel 26 arranged along the left and right direction and connected with the first pulley 23 through a belt 24. Step speed change wheel 26 comprises relative first conical wheel 27 and second conical wheel 28, and described second conical wheel 2...

Embodiment 3

[0049] Embodiment 3, on the basis of Embodiment 1, because the heat dissipation of the traditional main chassis is mostly equipped with a fan, the main chassis is ventilated, the heat dissipation effect is not good, and the use of draft heat dissipation makes the airflow not flow well, and the heat dissipation effect no, see figure 2 The cooling fan 3 installed on the front end of the cooling box 2 draws air toward the inside of the cooling box 2, and the cooling fan 3 installed on the rear end of the cooling box 2 blows air toward the outside of the cooling box 2, through two groups of cooling fans 3 at the front and rear ends. Cooperating with the heat dissipation, the fluidity of the airflow inside the heat dissipation box 2 is accelerated, so that the heat dissipation effect is better.

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Abstract

The invention relates to a novel computer mainframe box, which effectively solves the problems that an existing computer mainframe box is poor in heat dissipation effect, and a large number of electric resources are wasted. According to the technical scheme, the heat dissipation device comprises a mainframe box, a heat dissipation box is fixed to one side of the mainframe box, heat dissipation fans are arranged at the front end and the rear end of the heat dissipation box, heat dissipation pipes are installed in the mainframe box and penetrate through the mainframe box to be arranged in the heat dissipation box, and condensing agents are contained in the heat dissipation pipes; A temperature control adjusting device is arranged in the main case, the heat dissipation pipe is connected witha flow adjusting device arranged in the main case, the heat dissipation pipe is connected with a flow speed adjusting device arranged in the heat dissipation box, the flow speed adjusting device comprises an impeller arranged in the heat dissipation pipe in a running fit mode, and the impeller is controlled by a motor to rotate. The mainframe box is ingenious in structure, high in practicability and good in heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a novel computer mainframe box. Background technique [0002] As we all know, the main box of the computer will emit heat during use. In order to ensure the normal operation of the main box, the heat generated must be dissipated in time. Working under these conditions will eventually cause the entire circuit inside the main chassis to be short-circuited, resulting in damage to its internal components. [0003] During the operation of the computer, since the operation of the internal components of the main chassis will generate a large amount of heat, it must be dissipated. However, most of the existing heat dissipation devices are equipped with a fan on one side of the memory to exhaust the memory. Because the fan is only pretending to be on one side of the memory, only one side of the memory is dissipated during the ventilation process, and the heat dissipation effect is not ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20G06F2200/201Y02D10/00
Inventor 张丽娟曹再辉葛露
Owner 盐城市金海洋机电科技有限公司
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