Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mosaic laminated type XYZ three-dimensional dynamic microdrive device

A three-dimensional dynamic and micro-drive technology, applied in the field of microelectronics, can solve problems such as limiting the accuracy of high-speed motion platforms, and achieve the effects of saving installation space, simplifying the structure, and compacting the structure

Pending Publication Date: 2019-04-26
GUANGDONG UNIV OF TECH
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the actuator system generated by micro-nano motion involves coupling modeling of multiple physical fields such as electricity, magnetism, mechanism, and functional materials. The motion performance is restricted and affected by multiple fields and multiple factors. It is the physical nature and influence law of material properties, structural dimensions and composition on nonlinear hysteresis, creep and drift effects. The lack of related theories has always limited the accuracy of high-speed motion platforms.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mosaic laminated type XYZ three-dimensional dynamic microdrive device
  • Mosaic laminated type XYZ three-dimensional dynamic microdrive device
  • Mosaic laminated type XYZ three-dimensional dynamic microdrive device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0048]Please refer to Figure 1 to Figure 12 , figure 1 Schematic diagram of the structure of the mosaic stacked XYZ three-dimensional dynamic micro-drive device provided by the present invention; figure 2 for figure 1 Schematic diagram of the mid-sole structure; image 3 for figure 1 Schematic diagram of the structure of the X-direction precision compensation unit; Figure 4 for figure 1 The structural diagram of another angle of the X-direction precision compensation unit in the middle; Figure 5 for image 3 Schematic diagram of the structure of the X-direction micro-motion stage; Figure 6 for figure 1 Schematic diagram of the structure of the Y-direction precision compensation unit in the center; Figure 7 for figur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mosaic laminated type XYZ three-dimensional dynamic microdrive device. The mosaic laminated type XYZ three-dimensional dynamic microdrive device comprises a bottom plate, a Y-directional precision compensation unit arranged on the bottom plate, and an X-directional precision compensation unit penetrating through the bottom plate and the Y-directional precision compensationunit from top to bottom, and further comprises a Z-directional precision compensation unit, wherein the Z-directional precision compensation unit is fixedly arranged inside the X-directional precision compensation unit, fixedly arranged on the lower surface of a terminal platform and used for compensating micro displacement of the terminal platform in the Z-axis direction; and the mosaic laminated type XYZ three-dimensional dynamic microdrive device further comprises a reading unit used for reading displacement in the X-axis, Y-axis and Z-axis directions, and an industrial personal computer used for correspondingly controlling the X-directional precision compensation unit, the Y-directional precision compensation unit and the Z-directional precision compensation unit. According to the mosaic laminated type XYZ three-dimensional dynamic microdrive device, a mosaic laminated type structure is adopted, the structure is compact, a framework is simplified, the mounting space is effectivelysaved, motion precision is improved, the functions of three-dimensional collaborative dynamic compensation and dynamic damping are realized, and the precision movement of the terminal platform is ensured.

Description

technical field [0001] The invention relates to the technical field of microelectronics, and more specifically, relates to a mosaic stacked XYZ three-dimensional dynamic micro-drive device. Background technique [0002] The high-quality and high-capacity manufacturing of microelectronic products depends on the combination of high-precision positioning and high-acceleration motion of key mechanisms. High-precision, high-acceleration motion and positioning can be achieved by combining macro and micro motions. However, The core issues such as the switching mechanism and behavior description of macro-micro composite high-speed motion and its subsystem motion, including digital description, vibration behavior, motion characteristics, and stability evaluation, have not been effectively resolved. The structural design of the high-speed precision motion platform, the design of the vibration suppression method and the determination of the control strategy have become the key to impro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67793H01L21/68714H01L21/68785
Inventor 张揽宇高健陈文华张金迪钟永彬刘亚超王晓亮梁俊朗钟耿君
Owner GUANGDONG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products