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Package structure

A technology of encapsulation structure and encapsulation shell, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., and can solve problems such as inability to provide functions

Pending Publication Date: 2019-04-26
上海兴感半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using the base island to place the chip, the base island can only be used to support the chip and cannot provide other functions. At present, when the function integration is extremely high, the base island that can only be used as a device for supporting the chip is no longer Be applicable

Method used

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Embodiment Construction

[0022] A packaging structure proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims.

[0023] see figure 1 It is a schematic bottom view of a package structure in a specific embodiment of the present invention, including a package case 100 and a plurality of hollowed out portions disposed on the bottom of the package case 100 . The packaging shell 100 is used to package the lead frame 106 . The wire trays are exposed in multiple hollowed-out parts, forming multiple exposed areas of the wire trays. The exposed areas of the lead trays are isolated from each other by the package shell, so as to avoid penetration of solder into the exposed areas of other lead trays when soldering the exposed areas of the lead trays. The exposed areas of the wire trays are connected as a whole insi...

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Abstract

The invention relates to a package structure, which includes a lead frame and a package shell. The lead frame is used for installing chips and provided with lead trays, the package shell is used for packaging the lead frame, and the bottom surface of the package shell is provided with a plurality of hollow parts; the lead trays are exposed to the multiple hollow parts, and a plurality of exposed areas of the lead trays are formed; and the exposed areas of the lead trays are separated by the package shell to avoid penetration of soldering tin into the exposed areas of other lead trays when welding the corresponding exposed area of each lead tray. According to the package structure, bottom end trays of the lead frame are designed as the lead trays with arc-shaped parts, the chips can be supported, and a non-uniform strong magnetic field can be generated by the arc-shaped parts of the lead trays to provide an auxiliary magnetic field for the chips of a sensor needing the auxiliary magnetic field.

Description

technical field [0001] The invention relates to the field of chip production and relates to a packaging structure. Background technique [0002] The semiconductor integrated circuit industry has experienced rapid growth. Technological advances in integrated circuit materials and design have produced generation after generation of integrated circuits. Each generation of integrated circuits has smaller and more complex circuits than the previous generation, but these advances also increase the complexity of the integrated circuit process. [0003] In the innovation of integrated circuits, the functional density, that is, the number of interconnecting devices per unit area, gradually increases, while the geometric size, such as the smallest component or circuit that can be formed by a process, also shrinks, and the packaging of integrated circuits is gradually increasing. It has been taken seriously and occupies an increasing proportion of research and development. [0004] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/31
CPCH01L23/3107H01L23/4952H01L23/49541H01L23/49568H01L2224/4811H01L2224/05554
Inventor 钟小军
Owner 上海兴感半导体有限公司
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