High heat dissipation graphene-polyimide composite film with insulating properties and preparation method thereof

A polyimide, polyimide precursor technology, applied in the field of graphene-polyimide composite film and its preparation, can solve problems such as limited heat transfer rate, and achieve improved dispersion and excellent insulation. Effect

Active Publication Date: 2021-12-10
PI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the graphene-polyimide composite materials prepared by these prior art only exhibit a very limited heat transfer rate, therefore, it is currently necessary to study the properties of polyimide and graphene without inhibiting the various advantages of Composite material with improved physical properties

Method used

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  • High heat dissipation graphene-polyimide composite film with insulating properties and preparation method thereof
  • High heat dissipation graphene-polyimide composite film with insulating properties and preparation method thereof
  • High heat dissipation graphene-polyimide composite film with insulating properties and preparation method thereof

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preparation example Construction

[0020] The invention provides a kind of preparation method of graphene-polyimide composite film, it comprises: step (1), adds imidization conversion liquid in polyimide precursor solution, prepares mixed solution; Step (2), Adding more than 2 layers of multilayer graphene particles into the solvent to prepare a graphene dispersion; step (3), mixing the mixed solution prepared in the above step (1) and the graphene dispersion prepared in the above step (2) , preparing a gel film; and step (4), heat-treating and imidizing the above-mentioned gel film,

[0021] In the above-mentioned step (3), the weight ratio of the above-mentioned graphene particles and the polyimide precursor is 3:97 to 8:92, based on the total weight of the solution, the above-mentioned graphene particles and the polyimide precursor The mixed solution prepared in the step (1) and the graphene dispersion prepared in the step (2) are mixed in such a manner that the content is 11 to 30 weight percent.

[0022] ...

Embodiment 1

[0049] Embodiment 1: the preparation of graphene-polyimide composite film

[0050] Preparation of polyamic acid

[0051] Put 320g of dimethylformamide (DMF) in a 0.5L reactor, set the temperature to 20°C, put in 27.59g of diaminophenyl ether (ODA) to dissolve, put 20.03g of benzene each time Pyremic dianhydride (PMDA) was dissolved after being injected twice in this way. After the dissolution was completed, 3.97 g of p-phenylenediamine (pPDA) was put into it, and after reacting for 30 minutes, the solution was sampled to measure the molecular weight. After that, after the reaction was completed, the temperature of the reactor was raised to 30°C, and then 1.00 g of pPDA was added to adjust the molar ratio of [diamine] / [dianhydride] to 1:1. After the input of the raw materials was completed, the reaction was sufficiently performed at 40°C for 2 hours to obtain a polyamic acid solution.

[0052] Preparation of imidization conversion solution

[0053] 2.8 g of β-picoline (...

Embodiment 2 and 3 and comparative example 1 and 2

[0058] Embodiment 2 and 3 and comparative example 1 and 2: the preparation of graphene-polyimide composite film

[0059] The weight ratio of above-mentioned polyamic acid and graphene particle is mixed as the weight ratio of 95:5, 92:8, 90:10 and 100:0 instead of 97:3, except that, by the same method as in Example 1 Method to prepare graphene-polyimide composite film.

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Abstract

The invention relates to a graphene-polyimide composite film comprising multilayer graphene particles and a preparation method thereof. According to the preparation method of the above-mentioned graphene-polyimide composite film, it can be prepared not only maintaining the insulating properties of polyimide It can also exhibit the high heat transfer characteristics of graphene, and has a high heat dissipation graphene-polyimide composite film with a light transmittance close to 0% shielding characteristics. Moreover, when the composite membrane is prepared by the above preparation method, the precipitation phenomenon can be improved by improving the dispersibility of the raw material. Therefore, the graphene-polyimide composite film of the present invention has excellent insulation, heat dissipation and shielding properties, and can be usefully used in the fields of electronic materials such as heat-resistant coating agents, insulating films, semiconductors, and electrode protection films.

Description

technical field [0001] The invention relates to a graphene-polyimide composite film containing multilayer graphene particles and a preparation method thereof. Background technique [0002] Polyimide not only exhibits excellent mechanical properties, but also has properties such as heat resistance, insulation, solvent resistance, low temperature resistance, and low dielectric constant. Therefore, it is used in electronic products, computers, insulating supports, film and other fields. [0003] Recently, in order to improve the mechanical strength of polyimide, composites prepared by filling carbon-based fillers with excellent mechanical strength, such as nanomaterials such as carbon nanotubes and graphene, into polyimide resins are being carried out. research on materials. [0004] Graphene is a continuous chemical bond of multiple carbon atoms. It is a carbon-based filler with sp2 hybridization bonds of carbon. A thin substance of about 2 parts per billion. Graphene is n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08K3/04C08L79/08B29C71/02C08K7/00C08J3/20C08J3/075C08J3/21
CPCB29C71/02C08J3/075C08J3/20C08J3/21C08J5/18C08K3/04C08K7/00C08L79/08C08K3/042C08K2201/001
Inventor 吴智宁林铉才李吉男白承烈
Owner PI ADVANCED MATERIALS CO LTD
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