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PCB board with heat dissipation device

A technology for PCB boards and cooling devices, which is applied in the direction of circuit heating devices, printed circuit components, etc., can solve the problems of poor heat dissipation of PCB boards, and achieve the effects of good heat dissipation performance, convenient use, and simple structure

Inactive Publication Date: 2019-04-30
随州职业技术学院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the problem of poor heat dissipation of the PCB board in the electronic device in the prior art, and provide a PCB board with a simple structure and good heat dissipation with a heat dissipation device

Method used

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  • PCB board with heat dissipation device

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Embodiment Construction

[0008] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0009] see figure 1 , a PCB board with a heat dissipation device, comprising a PCB substrate 1 and a mounting hole 2, the mounting hole 2 runs through the PCB substrate 1 longitudinally, and the bottom of the PCB substrate 1 is sequentially provided with an insulating layer 3 and a heat-conducting copper layer 4, and the installation The hole 2 is equipped with a heat dissipation copper block 5, the heat dissipation copper block 5 passes through the insulating layer 3 and is directly connected with the heat conduction copper layer 4, the top of the heat dissipation copper block 5 is located on the PCB substrate 1, and the heat dissipation copper block 5 is fixed on the installation surface through the rubber ring 6. Inside the hole 2, the thickness of the insulating layer 3 is between 1-5 mm.

[0010] When the electronic device on the PCB subst...

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Abstract

Disclosed is a PCB board with heat dissipation device. The PCB board includes a PCB substrate and mounting holes. The mounting holes longitudinally pass through the PCB substrate. An insulating layerand a heat conduction copper layer are arranged on the bottom of the PCB substrate in order. A heat dissipation copper block is mounted in each mounting hole. The heat dissipation copper blocks pass through the insulating layer and are directly connected to the heat conduction copper layer. The tops of the heat dissipation copper blocks are located above the PCB substrate. The heat dissipation copper blocks are fixed to the inside of the mounting holes through rubber rings. The thickness of the insulating layer is between 1 and 5 millimeters.

Description

technical field [0001] The invention relates to a PCB board with a heat dissipation device. Background technique [0002] With the increasingly complex electrical characteristics of modern electronic products, the requirements for power supply and signal are getting higher and higher. There are many electronic devices on the PCB, and the electrical devices will generate heat when they work, which will increase the internal temperature of the equipment. At present, the widely used PCB board is epoxy glass cloth base material or phenolic resin glass cloth base material, and its heat dissipation is relatively low. Poor, the ability of the plate itself to conduct heat is very weak, and over time, it will affect the performance of electronic devices. Contents of the invention [0003] The purpose of the present invention is to overcome the problem of poor heat dissipation of the PCB board in the electronic device in the prior art, and provide a PCB board with a heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0204
Inventor 徐方方张杰程静
Owner 随州职业技术学院
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