Chemical tank for wet etching

Abstract

The invention discloses a chemical tank for wet etching, and the chemical tank comprises a first tank body which is provided with an etching region and is used for placing an etching part; an etchingpiece bearing part which is arranged around the etching area and is provided with at least one first clamping groove arranged in the first direction; a rotating part which is arranged around the etching region and is provided with at least one second clamping groove in the first direction; and a spraying part which is provided with at least one nozzle and is used for spraying etching liquid to theetching region. According to the chemical tank for wet etching, the rotating part rotates to drive the vertical etching part to rotate along the central axis of the etching part; chemicals sprayed bythe spraying part are uniformly sprayed on the rotating etching part rather than a fixed area of the to-be-etched surface of the etching part, so that the fluid shape caused by overflow to the to-be-etched surface of the etching part is weaker, the etching uniformity of the etching part is better, the problems of critical dimension, side drawing, poor uniformity of a metal mask layer and the likecaused by a traditional wet chemical tank are solved, and the metal wet etching uniformity is improved.

Description

technical field [0001] The invention belongs to the field of integrated circuit manufacturing technology, and more specifically relates to a chemical bath for wet etching. Background technique [0002] In the field of semiconductor manufacturing, metals in metal etching include Al / Cu / Ni / Ti / Au / Cr, etc., and dry etching can be used, but the cost of dry etching is relatively high. The wet etching method is low in cost, and in order to save costs, the metal wet etching method is usually used. In the existing wet bench process, such as figure 1 As shown, the transfer and processing of the etched parts in the chemical tank, spraying chemicals through the nozzle and bringing back the overflowing chemicals by the circulation pump, due to factors such as the long soaking time of the etched parts in the chemical tank and the direct injection of the nozzle As a result, the uniformity of wet etching in the prior art is relatively poor, and the uniformity of the metal is about 30%, whi...

AI Technical Summary

Problems solved by technology

In the existing wet bench process, such as figure 1 As shown, the transfer and processing of the etched parts in the chemical tank, spraying chemicals through the nozzle and bringing back the overflowing chemicals by the circulation pump, due to factors such as the long soaking time of the etched parts in the chemical tank and the direct injection of the nozzle As a result, the uniformity of wet etching in the prior art is relatively poor, and the uniformity of the metal is about 30%, which leads to defects in many production lines, such as critical dimensions, undercuts, poor uniformity of the metal mask layer, critical dimensions and metal mask layer Poor uniformity will affect the overall follow-up process, making the data unaccurately controllable, resulting in many defects in the device, and side digging will cause the material to be retained in the lower layer to be gnawed, destroying the entire device structure, and seriously affecting the function of the device. It can be seen that this Metal wet etching method can not meet the process requirements

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