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Diode arrangement device

A technology for arranging devices and diodes, applied in packaging and other directions, can solve problems such as uneven arrangement of diodes, achieve convenient processing and improve production efficiency

Active Publication Date: 2019-05-07
ANHUI LONGXINWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention intends to provide a diode arrangement device to solve the problem of irregular arrangement of diodes during braiding in existing diode production

Method used

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Embodiment Construction

[0015] The following is further described in detail through specific implementation methods:

[0016] The reference signs in the drawings of the specification include: conveyor chain 1, groove 2, pin 3, centering strip 4, glue roller 5, circular surface 6, conical surface 7, film guide plate 8, film release plate 9 , pressing roller 10, pipe body 11, bonding wheel 12, sponge layer 13, film 14.

[0017] The embodiment is basically as attached figure 1 , figure 2 Shown: a diode array device, including a frame (not shown in the figure) and two conveyor chains 1 fixed on the frame parallel to each other, and the links of the conveyor chain 1 are provided with pins 3 for clamping diodes. There are two centering strips 4 arranged side by side between the two conveyor chains 1. The distance is equal to the length of the tube body 11 of the diode, and the top surface of the centering bar 4 is flush with the inner bottom surface of the groove 2 . The upper and lower sides of the c...

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PUM

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Abstract

The invention discloses a diode arrangement device in the field of diode machining. The diode arrangement device comprises two conveying chains, wherein grooves used for clamping diode pins are formedin chain links of the conveying chains, two pairs of centering strips which are arranged side by side are arranged between the two conveying chains, the two ends of the centering strips are bent towards the conveying chains, and the distance between the middle parts of the two centering strips is equal to the length of a diode body, and the top surfaces of the centering strips are flush with thearc bottoms of the grooves; the upper sides and the lower sides of the centering strips are symmetrically distributed with bonding mechanisms on the plane where the centering strips are located; and each bonding mechanism comprises a bonding wheel, the wheel surface of each bonding wheel comprises a circular ring surface in the middle and conical surfaces located on the two sides of the circular ring surface, the large-diameter ends of the conical surfaces are connected with the circular ring surfaces, the axial length of the circular ring surfaces is equal to that of the diode body, gluing rollers which are in rolling contact with the circular ring surfaces are arranged on the outer sides of the bonding wheels, and one ends, close to the centering strips, of the bonding wheels are abuttedagainst the diode body. According to the diode arrangement device, the problem that diodes are not orderly arranged when the diodes are produced in the prior art can be solved.

Description

technical field [0001] The invention relates to the field of diode production, in particular to a diode arrangement device. Background technique [0002] With the development and progress of science and technology, more and more human activities are developing in the direction of intelligence and automation. This process is indispensable to rely on the development of the electronics industry. Basic parts in the electronics industry such as diodes, triodes and other semiconductor components The demand for semiconductor components is increasing day by day, and higher requirements are constantly being put forward for the production capacity of such semiconductor components. In the production process of diodes, the diodes after welding and polarizing are still in a single bulk state. Usually, adhesive tape or glue-coated film is used to arrange the diodes in a uniform direction and then bond them into strips for orderly storage. , this process is commonly referred to as the bra...

Claims

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Application Information

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IPC IPC(8): B65B15/04
Inventor 罗云红
Owner ANHUI LONGXINWEI TECH CO LTD