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An interlayered structure for joining dissimilar materials and a method of joining dissimilar metals

A sandwich structure, sandwich technology, applied in chemical instruments and methods, welding/cutting media/materials, metal processing, etc., can solve problems such as hindering interface stability and strength

Active Publication Date: 2019-05-14
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this energy input enables the formation of detrimental phases, which significantly hinder the stability and strength of the interface between two dissimilar metals.
This makes it a challenge to design airframe structures that utilize both titanium and steel systems, while meeting the design criteria for joints,

Method used

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  • An interlayered structure for joining dissimilar materials and a method of joining dissimilar metals
  • An interlayered structure for joining dissimilar materials and a method of joining dissimilar metals
  • An interlayered structure for joining dissimilar materials and a method of joining dissimilar metals

Examples

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Embodiment Construction

[0025] figure 1 An exemplary sandwich structure 100 for joining dissimilar materials is illustrated, comprising a first material substrate 110, a second material substrate 120 having a composition different from that of the first material substrate, and a substrate disposed between the first material substrate and the second material substrate. A plurality of interlayers 130 therebetween. The plurality of interlayers includes a first interlayer 132 closest to the first material substrate and a last interlayer 136 closest to the second material substrate.

[0026] figure 2 Another exemplary sandwich structure 200 for joining dissimilar materials is illustrated, which includes a first material substrate 210, a second material substrate 220 having a composition different from that of the first material substrate, and disposed between the first material substrate and the second material substrate. A plurality of interlayers 230 between the material substrates. The plurality of...

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Abstract

The invention provides an interlayered structure for joining dissimilar materials and a method of joining dissimilar metals. The structure includes a first material substrate, a second material substrate having a composition dissimilar from a composition of the first material substrate, and a plurality of interlayers disposed between the first material substrate and the second material substrate,including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.

Description

technical field [0001] This description relates to the field of joining dissimilar materials, in particular joining titanium-based components to iron-based components by friction welding. Background technique [0002] There is increased interest in linking different materials to produce compositional hierarchies. However, joining dissimilar materials involves many challenges, including metallurgical incompatibility between different materials. [0003] Titanium-based alloys are often considered for use due to their excellent mechanical and metallurgical properties, and there is an increased interest in joining titanium-based alloys with dissimilar materials such as stainless steel, which have excellent weldability and are much less expensive than titanium-based alloys . Traditionally, titanium-based alloys and iron-based alloys, such as steel, have been difficult to join. Most joining and soldering techniques involve some sort of heat input to generate the energy needed f...

Claims

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Application Information

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IPC IPC(8): B23K20/12B23K20/227B23K103/24
CPCB23K20/12B23K20/129B23K20/16B23K20/227B23K20/24B23K2101/18B23K2103/24B23K35/004B23K35/005B32B15/013B23K20/1205
Inventor A·E·曼恩
Owner THE BOEING CO
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