Efficient and simple thermal analysis method for electronic product reliability simulation analysis

A technology of simulation analysis and electronic products, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve problems that are not suitable, achieve simplification of complexity, overcome the long time spent, and overcome the relatively high consumption of computing resources big effect

Active Publication Date: 2019-05-21
BEIHANG UNIV
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Problems solved by technology

At this time, the finite element / finite volume method is not suitable for solving such problems

Method used

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  • Efficient and simple thermal analysis method for electronic product reliability simulation analysis
  • Efficient and simple thermal analysis method for electronic product reliability simulation analysis
  • Efficient and simple thermal analysis method for electronic product reliability simulation analysis

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Embodiment Construction

[0027] In order to make the features and advantages of the present invention more clearly understood, below in conjunction with accompanying drawing, describe in detail as follows: figure 1 The flow of the method is described.

[0028] When the user wants to perform thermal analysis and reliability evaluation on the working state of a rectangular PCB containing multiple components, the specific implementation steps of the high-efficiency and simple thermal analysis method oriented to electronic product reliability simulation analysis of the present invention are:

[0029] Step 1: Based on the data-driven method, the equivalent empirical coefficient formula of PCB thermal analysis parameters is established, including PCB equivalent physical property parameters, air physical property parameters, convective equivalent heat transfer coefficient empirical formula, radiation equivalent heat transfer coefficient empirical formula, Equivalent thermal resistance empirical formula, etc...

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Abstract

The invention relates to an efficient and simple thermal analysis method for electronic product reliability simulation analysis. The method comprises the steps of fitting and establishing an equivalent empirical coefficient formula of PCB thermal analysis parameters based on a data driving method; establishing a PCB three-dimensional geometric model; establishing a PCB three-dimensional simplifiedheat transfer mathematical model and deriving an analytical solution formula; Setting model parameters and initial qualitative temperature, and calling an equivalent empirical coefficient interface to calculate thermal analysis parameters; calculating the temperature field of each component serving as a heat source, calculating the PCB temperature distribution through superposition, and updatingthe qualitative temperature; carrying out iterative computation until convergence; and thermal analysis results required by PCB reliability evaluation are calculated through an interpolation method and equivalent thermal resistance. On the basis of ensuring the thermal analysis precision, the complexity of the model is greatly simplified, the defects that a finite element/finite volume simulationmethod is long in consumed time and large in calculation resource are overcome, and the problems of dynamic working load, parameter randomness and the like in PCB reliability evaluation can be well solved.

Description

Technical field [0001] The invention relates to the field of physical analysis of electronic product failures, especially Oriented to electronic product reliability simulation analysis Efficient and simple thermal analysis method . Background technique [0002] In recent years, with the rapid development of the electronics industry, the integration and performance of circuit boards in its products have been continuously improved, and power consumption has also doubled. Local high temperatures on circuit boards will lead to a decrease in performance and reliability, and even cause physical damage. If the thermal analysis of the circuit board can be carried out in the design stage, the temperature field of the circuit board under a certain working condition can be obtained, which can be used to evaluate its life and optimize the design, which can effectively improve the life and reliability of the circuit board. Therefore, the thermal analysis technology of integrated circ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 王自力夏权孙博任羿钱诚冯强杨德真
Owner BEIHANG UNIV
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