Radar circuit board air chamber manufacturing process
A manufacturing process and circuit board technology, which is applied in the field of radar circuit board air cavity manufacturing process, can solve the problem of remaining in the air cavity and so on
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[0020] The radar circuit board air cavity manufacturing process is characterized in that the specific steps are as follows:
[0021] a. Prepare layer A from top to bottom (thickness of layer A is 0.3mm), layer A includes upper layer L1 and lower layer L2, and drill holes on layer A as required;
[0022] b. Prepare layer B (thickness of layer B is 1.5mm), layer B includes upper layer L3 and lower layer L4, paste adhesive sheets on the upper and lower sides of layer B, and drill holes on layer B and adhesive sheet;
[0023] c. Prepare layer C (thickness of layer C is 0.3 mm). Layer C includes the upper layer L5 and the lower layer L6. Layers A, B, and C are pressed together in order from top to bottom.
[0024] The top view projected area of the hole in layer B is M, and the top view projected area of the hole in layer A is N, wherein M≥2N.
[0025] The hole in layer B is the same shape as the hole in layer A, and the corresponding hole in layer B is arranged concentrically...
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