Supercharge Your Innovation With Domain-Expert AI Agents!

Radar circuit board air chamber manufacturing process

A manufacturing process and circuit board technology, which is applied in the field of radar circuit board air cavity manufacturing process, can solve the problem of remaining in the air cavity and so on

Inactive Publication Date: 2019-05-21
GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the use of cars is becoming more and more common. In order to avoid collisions during car reversing and improve driving safety, many cars will be designed with reversing radar as an auxiliary device for parking and reversing. Some high-end car reversing radar circuit boards will have an air cavity design. , has achieved more sensitive detection of obstacles behind the reversing vehicle and more accurate testing of the distance between the rear end of the car and obstacles in order to give timely warnings and avoid accidents, but if the air cavity of the radar circuit board is designed as a semi-closed , it is impossible to process circuit boards using ordinary manufacturing processes, and a series of quality problems are caused by the solution or water of the wet process flowing into the air cavity and remaining in the air cavity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] The radar circuit board air cavity manufacturing process is characterized in that the specific steps are as follows:

[0021] a. Prepare layer A from top to bottom (thickness of layer A is 0.3mm), layer A includes upper layer L1 and lower layer L2, and drill holes on layer A as required;

[0022] b. Prepare layer B (thickness of layer B is 1.5mm), layer B includes upper layer L3 and lower layer L4, paste adhesive sheets on the upper and lower sides of layer B, and drill holes on layer B and adhesive sheet;

[0023] c. Prepare layer C (thickness of layer C is 0.3 mm). Layer C includes the upper layer L5 and the lower layer L6. Layers A, B, and C are pressed together in order from top to bottom.

[0024] The top view projected area of ​​the hole in layer B is M, and the top view projected area of ​​the hole in layer A is N, wherein M≥2N.

[0025] The hole in layer B is the same shape as the hole in layer A, and the corresponding hole in layer B is arranged concentrically...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a radar circuit board air chamber manufacturing process. The process comprises the following specific steps of: a, preparing an up-down layer A, and drilling holes in the layerA as required, wherein the layer A comprises an upper layer L1 and a lower layer L2; b, preparing a layer B, pasting bonding sheets on the upper and lower surfaces of the layer B and drilling holes in the layer B and the bonding sheets, wherein the layer B comprises an upper layer L3 and a lower layer L4; and c, preparing a layer C and laminating the layers A, B and C from top to bottom, whereinthe layer C comprises an upper layer L5 and a lower layer L6. According to the process, an air chamber is designed in a circuit board in a semi-enclosed manner, so that the process is suitable for theapplication in the aspects of automobile reversing radar and the like. The laminated circuit board does allow any wet process, so that water and solution are prevented from flowing into the air cavity through the holes and remaining in the air chamber to cause scrap. The process is clear, efficient and long in service life.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a manufacturing process of an air cavity of a radar circuit board. Background technique [0002] At present, the use of cars is becoming more and more common. In order to avoid collisions during car reversing and improve driving safety, many cars will be designed with reversing radar as an auxiliary device for parking and reversing. Some high-end car reversing radar circuit boards will have an air cavity design. , has achieved more sensitive detection of obstacles behind the reversing vehicle and more accurate testing of the distance between the rear end of the car and obstacles in order to give timely warnings and avoid accidents, but if the air cavity of the radar circuit board is designed as a semi-closed Therefore, it is impossible to process the circuit board using ordinary manufacturing processes, and the solution or water of the wet process flows into the air cavity...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00H05K3/46
Inventor 朱运辉唐兵英陈伟
Owner GUANGZHOU TERMBRAY ELECTRONICS TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More