A composite manifold and its manufacturing process

Abstract

The invention discloses a manufacturing process of a composite material bus plate, which includes setting several hollow structures on a conductive copper plate; manufacturing backfill for backfilling the hollow structure, and backfilling the backfill into the hollow structure of the conductive copper plate to obtain Conductive copper plate blanks; layout and stack several conductive copper plate blanks, and lay foam-type epoxy resin adhesive material between adjacent two layers of conductive copper plate blanks according to the thickness requirements between layers; prepare the semi-finished busbar; send the semi-finished busbar to Put it into a vacuum laminator for lamination, and after the lamination, the finished manifold is obtained; the composite manifold manufactured by the manufacturing process of the present invention meets the requirements of aviation, aerospace, etc., which have strict weight restrictions or pursue lightweight and miniaturized equipment and instruments The requirements for the manifold are to effectively reduce the overall weight of the manifold and improve the overall flatness of the manifold on the premise of ensuring the high insulation level, high reliability, local high current, and long-term working ability of the manifold.

Description

technical field [0001] The invention relates to a manifold, in particular to a composite manifold and its manufacturing process, which belongs to the technical field of multilayer printed circuit board manufacturing. Background technique [0002] Manifold is a special type of printed circuit board, which is mainly used in electronic equipment with high reliability, high current and long working time, such as some important communication equipment, because of its complex working environment, large working current, continuous continuous Intermittent work; therefore, it has high insulation level and reliability, diversified current distribution paths, and has a large current carrying capacity, which is an important guarantee for this type of electronic equipment; the bus board currently adopts the lamination process of printed circuit boards , using the substrate material and adhesive sheet material of the printed board, because the substrate material is epoxy resin reinforced ...

AI Technical Summary

Problems solved by technology

[0002] Manifold is a special type of printed circuit board, which is mainly used in electronic equipment with high reliability, high current and long working time, such as some important communication equipment, because of its complex working environment, large working current, continuous continuous Intermittent work; therefore, it has high insulation level and reliability, diversified current distribution paths, and has a large current carrying capacity, which is an important guarantee for this type of electronic equipment; the bus board currently adopts the lamination process of printed circuit boards , using the substrate material and adhesive sheet material of the printed board, because the substrate material is epoxy resin reinforced by glass fiber cloth, referred to as glass fiber epoxy resin, which solves the problem that the existing bus board is made by glue coating or dipping production process When the insulation level between the copper plates is not enough, when the manifold with insufficient insulation level is used in a high-humidity environment, it is prone to faults such as ignition and short circuit between the positive and negative electrodes that lead to insulation failure; but because the current manifold is made of glass The fiber cloth reinforced epoxy resin substrate material has a high material density. In the current manifold assembly, the volume ratio of each layer of conductive copper plate is between 25-40%, and the remaining 60-75% is reinforced by glass fiber cloth. Therefore, the overall mass of the manifold is large and heavy, which cannot meet the requirements of aviation, aerospace and other equipment and instruments that have strict weight restrictions or pursue light weight and miniaturization. In order to ensure the high insulation of the manifold Under the premise of the quality requirements of high grade, high reliability, local high current, and long-time working ability, how to reduce the overall weight of the manifold and at the same time improve the overall flatness of the manifold is the main purpose of the present invention

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