Mattress and temperature control device thereof

Abstract

The invention discloses a mattress and a temperature control device thereof. The temperature control device comprises a semiconductor refrigerating plate, a drive axle and a control unit; the drive axle is provided with a first upper arm, a first lower arm, a second upper arm and a second lower arm; the control unit controls the first upper arm and the second lower arm to form a circuit with the semiconductor refrigerating plate so as to allow the semiconductor refrigerating plate to work in a heating mode, and controls conducting of the second upper arm and the first lower arm to form a circuit with the semiconductor refrigerating plate so as to allow the semiconductor refrigerating plate to work in a refrigerating mode; the control unit is used for controlling continuous conducting of the first upper arm and regulating conducting time of the second lower arm so as to control heating power of the semiconductor refrigerating plate , and further for controlling continuous conducting ofthe second upper arm and regulating conducting time of the first lower arm so as to control refrigerating power of the semiconductor refrigerating plate. Therefore, work mode and work power of the semiconductor refrigerating plate are controlled by controlling conducting circuit and conducting time of the drive axle.

Description

technical field [0001] The invention relates to the field of power electronics technology, in particular to a temperature control device for a mattress and a mattress. Background technique [0002] At present, the heating and cooling of the liquid by the water bed in the related art is usually controlled by two independent systems, that is, using semiconductor refrigeration chips for cooling and PTC (Positive Temperature Coefficient, thermistor) heating; or by using an H-bridge circuit, and The relay is used to control the on-off work of the semiconductor refrigeration sheet. [0003] However, there are at least the following problems in the related technology: 1) If semiconductor refrigeration chips and PTC are used to control the liquid temperature, a PTC heating system needs to be added, which leads to an increase in cost, and there are certain difficulties in the structural design and production assembly of the whole machine; 2) If the H-bridge circuit composed of relay...

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Problems solved by technology

[0003] However, there are at least the following problems in the related technology: 1) If semiconductor refrigeration chips and PTC are used to control the temperature of the liquid, a PTC heating system needs to be added, which leads to an increase in cost, and there are certain difficulties in the structural design and production assembly of the whole machine; 2) If the H-bridge circuit composed of relays is used to control the current direction of the semiconductor refrigerating sheet, it can only control the continuous heating or cooling of the refrigerating sheet, and cannot finely adjust the water temperature, and the temperature control performance is poor.

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