Tool and method for machining groove in package substrate
A technology for encapsulating substrates and fixtures, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as the quality of the groove wall that is prone to deviation in cutting products, low yield rate, and high manufacturing cost.
Active Publication Date: 2019-05-24
GUANGZHOU FASTPRINT CIRCUIT TECH +1
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Problems solved by technology
[0004] The present invention aims at the problems that the existing jig for processing the inner groove of the packaging substrate has defects such as easy deviation of the cutting product and poor quality of the groove wall, resulting in low yield and high manufacturing cost, and provides a method for processing and packaging Jig and processing method for substrate inner groove
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[0040] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following descriptions of the specific implementations are only exemplary, and it should be understood that the specific implementations described here are only used to explain the present invention, but not to limit the present invention and its application or usage.
[0041] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. In con...
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The invention relates to a tool for machining a groove in a package substrate. The tool comprises a tool plate provided with a plurality of air guide grooves arranged in a rectangular array. When thepackage substrate is subjected to a cutting process, a to-be-cut portion of the package substrate is aligned with the air guide grooves. The package substrate is flatly adsorbed to the surface of thetool through the air guide grooves. An adsorption groove is further disposed on the tool plate, and is disposed around the periphery of the air guide grooves. The vacuum absorption force is further provided for the package substrate through the adsorption groove to ensure that the package substrate can be smoothly and firmly adsorbed to the surface of the tool. Thus, a phenomenon is avoided that as the groove is machined, the vacuum adsorption force provided for the package substrate through the air guide groove gradually decreases, thus a gap may be generated between the package substrate andthe tool surface and even the package substrate may protrude from the surface of the tool, resulting in defects such as misalignment and poor wall quality of a cutting product. The invention also provides a method for machining a groove in a package substrate.
Description
technical field [0001] The invention relates to the package substrate industry, in particular to a jig and a processing method for processing an inner groove of a package substrate. Background technique [0002] The high-precision inner groove is mainly used in the packaging substrate industry, and its main purpose is to place wafers. The high-precision inner groove has the characteristics of high precision (dimensional accuracy ±20μm) and strict requirements on the quality of the groove wall (the groove wall is vertical, no chip shedding), etc. [0003] In the existing jig for processing the inner groove of the packaging substrate, the packaging substrate and the surface of the jig are fixed by vacuum adsorption. The packaging substrate is flatly attached to the surface of the jig by vacuum adsorption, and then the groove is formed by UV cutting. However, in the existing jigs used to process the inner groove of the packaging substrate, there will be a gap between the pack...
Claims
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IPC IPC(8): H01L21/67H01L21/02
Inventor 张凯吴鉴波孙宏超
Owner GUANGZHOU FASTPRINT CIRCUIT TECH