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Adsorption device, lamination equipment, and lamination method for substrates

A technology of adsorption device and pressing equipment, which is applied in the direction of identification device, instrument, etc., can solve the problems of line damage, low efficiency, and inability to realize mass production, and achieve the effect of meeting mass production requirements and smooth adsorption

Active Publication Date: 2022-05-31
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is inefficient and cannot be mass-produced; and during the pressing process, the in-plane circuit will be touched, and there is a risk of circuit damage

Method used

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  • Adsorption device, lamination equipment, and lamination method for substrates
  • Adsorption device, lamination equipment, and lamination method for substrates
  • Adsorption device, lamination equipment, and lamination method for substrates

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Embodiment Construction

[0022] See Figure 3. FIG. 3 is a schematic structural diagram of an adsorption device according to an embodiment of the present application. This application provides

[0023] As shown in FIG. 3, in the embodiment of the present application, the stage 10 includes a plurality of adsorption holes 101, and the adsorption holes

[0024] Continuing to FIG. 3, each of the adsorption mechanisms 11 includes a soft suction nozzle 110 and a vacuum pipe 111, each of the soft

[0025] In this embodiment, each of the soft suction nozzles 110 is disposed in a corresponding one of the suction holes 101 close to the base

[0026] As a preferred embodiment, the cross-sectional shape of the soft suction nozzle 110 includes, but is not limited to, a circle, a square, to

[0029] In some other embodiments, the connection between the soft suction nozzle 110 and the suction hole 101 includes but is not limited to

[0030] It should be noted that since the substrate 100 is warped toward the side away fr...

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Abstract

The present application discloses an adsorption device, comprising: a carrier set on one side of a substrate, including a plurality of adsorption holes; a plurality of adsorption mechanisms, arranged on the carrier, each of the adsorption mechanisms includes a soft Each of the soft suction nozzles is configured to independently rise and fall along the axial direction of one of the suction holes and is used for suctioning the surface of the substrate, so as to correct the warpage of the substrate.

Description

Adsorption device, pressing equipment and method for pressing substrates technical field [0001] The application relates to the technical field of fixtures for display devices, in particular to a suction device, a lamination device and a substrate the pressing method. Background technique [0002] At present, the display panel is diversified, and the resolution and color of Mini LED are close to OLED, which is better than LCD; And lower power consumption, lighter and thinner. However, Mini LED is a single-layer substrate, and the surface stress is large (the proportion of metal is more than 75%), and After multi-stage high temperature baking of white oil + patch (SMT), the warpage of the substrate is greater than or equal to 1.5 mm (conventional LCD is less than 1.0 mm). In the lamination process, the lamination process includes the following steps: providing a substrate, pressing an anisotropic conductive film (ACF), peeling off the base tape, Alignment, pre-pressin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/33
CPCG09F9/33
Inventor 陈皓
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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