a kind of mosi 2 -sic-cu conductance composite ceramic material and preparation method thereof
A composite ceramic, mosi2-sic-cu technology, applied in the direction of metal/alloy conductors, etc., can solve the problems of poor comprehensive performance of SiC-Cu composite materials, and improve low-temperature and high-temperature mechanical properties, good thermal conductivity and mechanical properties. , the effect of high hardness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0034] MoSi in this example 2-SiC-Cu conductive composite ceramic material, composed of the following components in volume percentage: SiC10%, the balance is MoSi 2 and Cu; MoSi 2 The volume ratio of Cu and Cu is 1:2.
[0035] MoSi in this example 2 -The preparation method of SiC-Cu conductance composite ceramic material, comprises the following steps:
[0036] 1) Take the amount of MoSi in the formula 2 Powder, SiC powder and Cu powder are mixed and passed through a 200-mesh sieve for 5 times, and then ground evenly to obtain MoSi 2 -SiC-Cu composite powder; MoSi 2 The particle size of the powder is 3 μm; the particle size of the SiC powder is 10 μm; the particle size of the Cu powder is 48 μm;
[0037] 2) the MoSi obtained in step 1) 2 - SiC-Cu composite powder is poured into a graphite mold, the graphite mold is put into a vacuum hot-pressing sintering furnace, vacuumized, pre-pressed at room temperature and 30MPa for 5 minutes, and the pressure is released to obtain...
Embodiment 2
[0041] MoSi in this example 2 -SiC-Cu conductive composite ceramic material, composed of the following components in volume percentage: SiC10%, the balance is MoSi 2 and Cu; MoSi 2 The volume ratio to Cu is 1:1.5.
[0042] MoSi in this example 2 -The preparation method of SiC-Cu conductance composite ceramic material, comprises the following steps:
[0043] 1) Take the amount of MoSi in the formula 2 Powder, SiC powder and Cu powder are mixed and passed through a 200-mesh sieve for 5 times, and then ground evenly to obtain MoSi 2 -SiC-Cu composite powder; MoSi 2 The particle size of the powder is 3 μm; the particle size of the SiC powder is 10 μm; the particle size of the Cu powder is 48 μm;
[0044] 2) the MoSi obtained in step 1) 2 - SiC-Cu composite powder is poured into a graphite mold, the graphite mold is put into a vacuum hot-pressing sintering furnace, vacuumized, pre-pressed at room temperature and 30MPa for 5 minutes, and the pressure is released to obtain a g...
Embodiment 3
[0047] MoSi in this example 2 - SiC-Cu conductive composite ceramic material, composed of the following components in volume percentage: SiC30%, the balance is MoSi 2 and Cu; MoSi 2 The volume ratio of Cu and Cu is 1:1.
[0048] MoSi in this example 2 -The preparation method of SiC-Cu conductance composite ceramic material, comprises the following steps:
[0049] 1) Take the amount of MoSi in the formula 2 SiC powder, SiC powder and Cu powder are mixed and passed through a 200-mesh sieve for 3 times, and then ground evenly to obtain MoSi 2 -SiC-Cu composite powder; MoSi 2 The particle size of SiC powder is 1 μm; the particle size of SiC powder is 8 μm; the particle size of Cu powder is 40 μm;
[0050] 2) the MoSi obtained in step 1) 2 - SiC-Cu composite powder is poured into a graphite mold, the graphite mold is put into a vacuum hot-pressing sintering furnace, vacuumized, pre-pressed at room temperature and 40MPa for 8 minutes, and the pressure is released to obtain a ...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com