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a kind of mosi 2 -sic-cu conductance composite ceramic material and preparation method thereof

A composite ceramic, mosi2-sic-cu technology, applied in the direction of metal/alloy conductors, etc., can solve the problems of poor comprehensive performance of SiC-Cu composite materials, and improve low-temperature and high-temperature mechanical properties, good thermal conductivity and mechanical properties. , the effect of high hardness

Active Publication Date: 2021-06-04
ZHENGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a MoSi with high density, high hardness, high wear resistance and excellent electrical and thermal conductivity. 2 - SiC-Cu conductive composite ceramic material, which can solve the problem of poor comprehensive performance of SiC-Cu composite materials in the prior art

Method used

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  • a kind of mosi  <sub>2</sub> -sic-cu conductance composite ceramic material and preparation method thereof
  • a kind of mosi  <sub>2</sub> -sic-cu conductance composite ceramic material and preparation method thereof
  • a kind of mosi  <sub>2</sub> -sic-cu conductance composite ceramic material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] MoSi in this example 2-SiC-Cu conductive composite ceramic material, composed of the following components in volume percentage: SiC10%, the balance is MoSi 2 and Cu; MoSi 2 The volume ratio of Cu and Cu is 1:2.

[0035] MoSi in this example 2 -The preparation method of SiC-Cu conductance composite ceramic material, comprises the following steps:

[0036] 1) Take the amount of MoSi in the formula 2 Powder, SiC powder and Cu powder are mixed and passed through a 200-mesh sieve for 5 times, and then ground evenly to obtain MoSi 2 -SiC-Cu composite powder; MoSi 2 The particle size of the powder is 3 μm; the particle size of the SiC powder is 10 μm; the particle size of the Cu powder is 48 μm;

[0037] 2) the MoSi obtained in step 1) 2 - SiC-Cu composite powder is poured into a graphite mold, the graphite mold is put into a vacuum hot-pressing sintering furnace, vacuumized, pre-pressed at room temperature and 30MPa for 5 minutes, and the pressure is released to obtain...

Embodiment 2

[0041] MoSi in this example 2 -SiC-Cu conductive composite ceramic material, composed of the following components in volume percentage: SiC10%, the balance is MoSi 2 and Cu; MoSi 2 The volume ratio to Cu is 1:1.5.

[0042] MoSi in this example 2 -The preparation method of SiC-Cu conductance composite ceramic material, comprises the following steps:

[0043] 1) Take the amount of MoSi in the formula 2 Powder, SiC powder and Cu powder are mixed and passed through a 200-mesh sieve for 5 times, and then ground evenly to obtain MoSi 2 -SiC-Cu composite powder; MoSi 2 The particle size of the powder is 3 μm; the particle size of the SiC powder is 10 μm; the particle size of the Cu powder is 48 μm;

[0044] 2) the MoSi obtained in step 1) 2 - SiC-Cu composite powder is poured into a graphite mold, the graphite mold is put into a vacuum hot-pressing sintering furnace, vacuumized, pre-pressed at room temperature and 30MPa for 5 minutes, and the pressure is released to obtain a g...

Embodiment 3

[0047] MoSi in this example 2 - SiC-Cu conductive composite ceramic material, composed of the following components in volume percentage: SiC30%, the balance is MoSi 2 and Cu; MoSi 2 The volume ratio of Cu and Cu is 1:1.

[0048] MoSi in this example 2 -The preparation method of SiC-Cu conductance composite ceramic material, comprises the following steps:

[0049] 1) Take the amount of MoSi in the formula 2 SiC powder, SiC powder and Cu powder are mixed and passed through a 200-mesh sieve for 3 times, and then ground evenly to obtain MoSi 2 -SiC-Cu composite powder; MoSi 2 The particle size of SiC powder is 1 μm; the particle size of SiC powder is 8 μm; the particle size of Cu powder is 40 μm;

[0050] 2) the MoSi obtained in step 1) 2 - SiC-Cu composite powder is poured into a graphite mold, the graphite mold is put into a vacuum hot-pressing sintering furnace, vacuumized, pre-pressed at room temperature and 40MPa for 8 minutes, and the pressure is released to obtain a ...

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Abstract

The present invention relates to a kind of MoSi 2 ‑SiC‑Cu conductive composite ceramic material and preparation method thereof, belonging to the technical field of slide plate conductive materials. MoSi of the present invention 2 ‑SiC‑Cu conductive composite ceramic material, composed of the following components in volume percentage: SiC10~30%, the balance is MoSi 2 and Cu; MoSi 2 The volume ratio to Cu is 1:1 to 2.5. MoSi of the present invention 2 ‑SiC‑Cu Conductive Composite Ceramic Material, Integrated MoSi 2 The advantages of SiC, Cu, and SiC are synergistic and complementary, and have excellent electrical and thermal conductivity and wear resistance. Brushes and slip rings have broad application prospects.

Description

technical field [0001] The present invention relates to a kind of MoSi 2 -SiC-Cu conductive composite ceramic material and preparation method thereof, belonging to the technical field of slide plate conductive materials. Background technique [0002] Pure copper has very good electrical and thermal conductivity, but its lack of strength at room temperature, high temperature strength and hardness limits its practical application. By adding second-phase solid particles to the copper matrix, not only can the mechanical properties of the material be improved , friction and wear properties, and also maintains the excellent electrical and thermal conductivity of copper, which greatly expands the application field of copper. [0003] Molybdenum disilicide (MoSi 2 ) is an intermediate phase with the highest silicon content in the Mo-Si binary alloy system. It has the dual characteristics of metal and ceramics, and has a high melting point (2030-2050 ° C), moderate density (6.24g / c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C32/00C22C1/05C22C1/10H01B1/02
Inventor 张锐范冰冰邵刚代巧飞王海龙范书珩陈德良许红亮卢红霞
Owner ZHENGZHOU UNIV
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